المؤلفون: Desmulliez, M. P. Y., Pang, A. J., Leonard, M., Dhariwal, R. S., Yu, W., Abraham, E., Bognar, Gy., Poppe, A., Horvath, Gy., Kohari, Zs., Rencz, M., Emerson, D., Barber, R. W., Slattery, O., Waldron, F., Cordero, N.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 32(1):20-29 Mar, 2009

المؤلفون: Kohari, Zs., Szekely, V., Rencz, M., Dudek, V., Hofflinger, B.

المصدر: 27th European Solid-State Device Research Conference Solid-State Device Research Conference, 1997. Proceeding of the 27th European. :496-499 1997

Relation: 27th European Solid-State Device Research Conference

المؤلفون: Szekely, V., Kohari, Zs., Marta, Cs., Rencz, M., Courtois, B.

المصدر: Proceedings of International Conference on Microelectronic Test Structures Microelectronic test structures Microelectronic Test Structures, 1996. ICMTS 1996. Proceedings. 1996 IEEE International Conference on. :111-115 1996

Relation: Proceedings of International Conference on Microelectronic Test Structures

المؤلفون: Poppe, A., Pohl, L., Kollr, E., Kohari, Zs., Lifka, H., Tanase, C.

المصدر: 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE. :38-44 Mar, 2009

Relation: 2009 IEEE/CPMT 25th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)

المؤلفون: Pohl, L., Kollar, E., Kohari, Zs., Poppe, A.

المصدر: 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on. :235-240 Sep, 2008

Relation: 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems (THERMINIC)

المؤلفون: Tarnay, K.^{Aff2, Aff3}, Masszi, F.^Aff2, Poppe, A.^Aff3, Verhás, P.^Aff3, Kocsis, T.^Aff3, Kohári, Zs.^Aff3

المساهمون: Selberherr, Siegfried, editor^Aff1, Stippel, Hannes, editor^Aff1, Strasser, Ernst, editor^Aff1

المصدر: Simulation of Semiconductor Devices and Processes : Vol.5. :477-480

المؤلفون: Morrissey, A ^*, Alderman, J, Kelly, G, Kohári, Zs, Páhi, A, Rencz, M

المصدر: In Microelectronics Journal November 1999 30(11):1109-1114

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