المؤلفون: Bucher, M., Kollipara, R. T., Su, B., Gopalakrishnan, L., Prabhu, K., Venkatesan, P. K., Kaviani, K., Daly, B., Stonecypher, B. W. F., Dettloff, W., Stone, T., Heaton, F., Lu, Y., Madden, C., Bangalore, S., Eble, J. C., Nguyen, N. M., Luo, L.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 49(1):127-139 Jan, 2014

المؤلفون: Ho, A., Stojanovic, V., Chen, F., Werner, C., Tsang, G., Alon, E., Kollipara, R., Zerbe, J., Horowitz, M.A.

المصدر: 2004 Symposium on VLSI Circuits. Digest of Technical Papers (IEEE Cat. No.04CH37525) VLSI circuits VLSI Circuits, 2004. Digest of Technical Papers. 2004 Symposium on. :352-355 2004

Relation: 2004 Symposium on VLSI Circuits. Digest of Technical Papers

المؤلفون: Sarfaraz, A., Yuan, C., Haw-Jyh Liaw, Gong-Jong Yeh, Kollipara, R.

المصدر: IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.. :177-180 2000

Relation: IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging

المؤلفون: Zerbe, J., Daly, B., Luo, L., Stonecypher, W., Dettloff, W., Eble, J. C., Stone, T., Ren, J., Leibowitz, B., Bucher, M., Satarzadeh, P., Lin, Q., Lu, Y., Kollipara, R.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 46(4):974-985 Apr, 2011

المؤلفون: Moncayo, A., Hindi, S., Ching-Chao Huang, Kollipara, R., Haw-Jyh Liaw, Nguyen, D., Perino, D., Sarfaraz, A., Yuan, C., Leddige, M., McCall, J., Xang Moua, Salmon, J.

المصدر: IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 1999. :11-14 1999

Relation: IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging

المؤلفون: Amirkhany, A., Abbasfar, A., Savoj, J., Jeeradit, M., Garlepp, B., Kollipara, R. T., Stojanovic, V., Horowitz, M.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 43(4):999-1009 Apr, 2008

المؤلفون: Kollipara, R., Lin, L., Oehrle, G.

المصدر: Electrical Performance of Electronic Packaging Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on. :121-124 1997

Relation: Electrical Performance of Electronic Packaging

المؤلفون: Chandasekaran, A., Kollipara, R., Sundaram, A.

المصدر: Proceedings of 1994 IEEE Workshop on Computers in Power Electronics Computers in power electronics Computers in Power Electronics, 1994., IEEE 4th Workshop on. :56-61 1994

Relation: Proceedings of 1994 IEEE Workshop on Computers in Power Electronics

المؤلفون: Chia, B., Kollipara, R., Oh, D., Yuan, C., Boluna, L.S.

المصدر: 2006 IEEE Electrical Performane of Electronic Packaging Electrical Performance of Electronic Packaging, 2006 IEEE. :281-284 Oct, 2006

Relation: 2006 IEEE Electrical Performane of Electronic Packaging

المؤلفون: Draper, D., Kollipara, R., Ming Li, Mullen, D., McMorrow, S.

المصدر: 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) Electronic components and technology Electronic Components and Technology Conference, 2004. Proceedings. 54th. 2:1200-1208 Vol.2 2004

Relation: 2004 Proceedings. 54th Electronic Components and Technology Conference