المؤلفون: Ye, Yuxin, Du, Xiangbin, Kong, Yanmei, Liu, Ruiwen, Yun, Shichang, Jia, Shiqi, Li, Wei, Lv, Xiaorui, Lin, Pengrong, Wang, Zhiqiang, Jiao, Binbin

المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1017-1021 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Wang Shu, Lin Teng, Jiao Binbin, Kong Yanmei, Ye Yuxin

المصدر: Dianzi Jishu Yingyong, Vol 45, Iss 5, Pp 98-101 (2019)

مصطلحات موضوعية: tire pressure sensor, energy harvesting circuit, self-power supply, Electronics, TK7800-8360

وصف الملف: electronic resource

Relation: http://www.chinaaet.com/article/3000101762; https://doaj.org/toc/0258-7998

URL الوصول: https://doaj.org/article/87888bf501f746cb85e5532ab59efcbb

المؤلفون: Du, Xiangbin, Ye, Yuxin, Kong, Yanmei, Liu, Ruiwen, Yun, Shichang, Jiao, Binbin, Xiaorui, Lv, Pengrong, Lin

المصدر: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Nano/Micro Engineered and Molecular Systems (NEMS), 2023 IEEE 18th International Conference on. :209-212 May, 2023

Relation: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

المؤلفون: Li, Wei, Ye, Yuxin, Yan, Yingzhan, Du, Xiangbin, Kong, Yanmei, Liu, Ruiwen, Wang, Zhiqiang, Jiao, Binbin

المصدر: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Nano/Micro Engineered and Molecular Systems (NEMS), 2023 IEEE 18th International Conference on. :120-123 May, 2023

Relation: 2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

المؤلفون: Qiao, Jingping, Jiao, Binbin, Jia, Shiqi, Liu, Ruiwen, Yun, Shichang, Kong, Yanmei, Ye, Yuxin, Du, Xiangbin, Yu, Lihang, Lu, Dichen, Liu, Ziyu, Wang, Jie

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :606-611 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Ye, Yuxin, Wang, Jie, Yu, Lihang, Kong, Yanmei, Liu, Ruiwen, Du, Xiangbin, Yun, Shichang, Shi, Yulin, Jiao, Binbin

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Zhang, Nan, Ye, Yuxin, Liu, Qinrang, Shen, Jianliang, Jiao, Binbin, Kong, Yanmei, Liu, Ruiwen, Cong, Bo, Yu, Lihang, Du, Xiangbin, Jia, Kunpeng, Jia, Shiqi

المصدر: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) Micro Electro Mechanical Systems Conference (MEMS), 2022 IEEE 35th International Conference on. :923-926 Jan, 2022

Relation: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)

المؤلفون: Ye, Yuxin, Yun, Shichang, Liu, Ruiwen, Li, Wei, Wang, Zhiqiang, Du, Xiangbin, Kong, Yanmei, Jia, Kunpeng, Zhang, Nan, Yu, Lihang, Cong, Bo, Jia, Shiqi, Jiao, Binbin, Chen, Dapeng

المصدر: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) Micro Electro Mechanical Systems Conference (MEMS), 2022 IEEE 35th International Conference on. :664-667 Jan, 2022

Relation: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)

المؤلفون: Ye, Yuxin, Zhang, Nan, Yu, Lihang, Cong, Bo, Liu, Ruiwen, Kong, Yanmei, Jiao, Binbin

المصدر: 2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Nano/Micro Engineered and Molecular Systems (NEMS), 2021 IEEE 16th International Conference on. :21-25 Apr, 2021

Relation: 2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

المؤلفون: Jiao, Binbin, Qiao, Jingping, Jia, Shiqi, Liu, Ruiwen, Wei, Xueyong, Yun, Shichang, Kong, Yanmei, Ye, Yuxin, Du, Xiangbin, Yu, Lihang, Cong, Bo

المصدر: In Engineering July 2024 38:201-208