المؤلفون: Hoshiyama, M., Hasegawa, M., Sato, T., Yoshii, H., Suzuki, O., Kotaka, K., Nagasaka, T., Horibe, A., Paquet, M.-C., Gaynes, M., Feger, C., Sakuma, K., Knickerbocker, J. U., Orii, Y., Terada, K., Ishikawa, K., Hirayama, Y.

المصدر: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International. :42-46 Oct, 2011

Relation: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Horibe, A., Paquet, M.-C., Gaynes, M., Feger, C., Sakuma, K., Knickerbocker, J. U., Orii, Y., Hoshiyama, M., Hasegawa, M., Sato, T., Yoshii, H., Suzuki, O., Kotaka, K., Nagasaka, T., Terada, K., Ishikawa, K., Hirayama, Y.

المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1003-1008 May, 2011

Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

المؤلفون: Kotaka, K., Suzuki, O., Fujiki, T., Suzuki, K., Homma, Y.

المصدر: Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. Electronic materials and packaging Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on. :43-48 2002

Relation: Proceedings of the 4th International Symposium on Electronic Materials and Packaging

المؤلفون: Kotaka, K., Abe, Y., Homma, Y.

المصدر: 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Electronic manufacturing technology and microelectronics IEMT/IMC Symposium, 2nd 1998. :369-373 1998

Relation: 2nd 1998 IEMT/IMC Symposium

المؤلفون: Fujiki, T., Tanaka, F., Homma, Y., Yoshii, H., Kotaka, K.

المصدر: Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) High density microsystem design and packaging and component failure analysis High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on. :221-223 2004

Relation: Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)

المؤلفون: Shinotsuka, M., Iwasa, H., Furukawa, R., Murata, S., Kotaka, K., Abe, M., Kageyama, Y., Umehara, M.

المصدر: International Symposium on Optical Memory and Optical Data Storage Topical Meeting Optical memory and optical data storage Optical Memory and Optical Data Storage Topical Meeting, 2002. International Symposium on. :234-236 2002

Relation: 2002 International Symposium on Optical Memory and Optical Data Storage Topical Meeting. Joint International Symposium on Optical Memory and Optical Data Storage 2002. Technical Digest

المؤلفون: Hoshino, Takashi, Kubo, Koichi, Nakamura, K., Yamashita, M., Hashimoto, T., Tomizawa, K., Ukai, T., Iwamoto, S., Yamamoto, H., Naitoh, Y., Yashima, H., Ueda, K., Nemoto, S., Ishikawa, T., Yamada, K., Suzuki, T., Negishi, T., Kotaka, K., Takeoka, K., Takagi, K., Okubo, M., Yasuda, K., Kamitamari, T., Tawa, K.

المصدر: SAE Transactions, 2005 Jan 01. 114, 1323-1333.

URL الوصول: https://www.jstor.org/stable/44721047

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