المؤلفون: Seidl, M., Gehring, M., Krumbein, U., Schrag, G.

المصدر: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019 20th International Conference on. :1-5 Mar, 2019

Relation: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Seidl, M., Gehring, M., Krumbein, U., Schrag, G.

المصدر: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018 19th International Conference on. :1-6 Apr, 2018

Relation: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Dettmer, H., Krumbein, U., Lendenmann, H., Muller, S., Fichtner, W., Bauer, F., Lilja, K., Stockmeier, T.

المصدر: [1993] Proceedings of the 5th International Symposium on Power Semiconductor Devices and ICs Power Semiconductor Devices and ICs, 1993. ISPSD '93., Proceedings of the 5th International Symposium on. :54-59 1993

Relation: Proceedings of ISPSD '93 - 1993 International Symposium on Power Semiconductor Devices and IC's

المؤلفون: Lendenmann, H., Dettmer, H., Krumbein, U., Fichtner, W., Bauer, F., Stockmeier, T.

المصدر: [1993] Proceedings of the 5th International Symposium on Power Semiconductor Devices and ICs Power Semiconductor Devices and ICs, 1993. ISPSD '93., Proceedings of the 5th International Symposium on. :66-70 1993

Relation: Proceedings of ISPSD '93 - 1993 International Symposium on Power Semiconductor Devices and IC's

المؤلفون: Yoder, P.D., Gartner, K., Krumbein, U., Fichtner, W.

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 16(10):1082-1087 Oct, 1997

المؤلفون: Korner, T.O., Krumbein, U., Bomholt, L. H., Fichtner, W.

المصدر: ESSDERC '96: Proceedings of the 26th European Solid State Device Research Conference Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European. :391-394 Sep, 1996

Relation: Proceedings of the 26th European Solid State Device Research Conference

المؤلفون: Korner, T.O., Regli, P., Krumbein, U., Fichtner, W.

المصدر: Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society LEOS '96 Lasers and Electro-Optics Society Annual Meeting, 1996. LEOS 96., IEEE. 1:186-187 vol.1 1996

Relation: Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society

المؤلفون: Lades, M., Schenk, A., Krumbein, U., Wachutka, G., Fichtner, W.

المصدر: 1996 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD '96 (IEEE Cat. No.96TH8095) Simulation of semiconductor processes and devices Simulation of Semiconductor Processes and Devices, 1996. SISPAD 96. 1996 International Conference on. :55-56 1996

Relation: Proceedings of International Conference on Simulation of Semiconductor Processes and Devices

المؤلفون: Schenk, A., Krumbein, U., Muller, S., Dettmer, H., Fichtner, W.

المصدر: [Proceedings] 1993 International Workshop on VLSI Process and Device Modeling (1993 VPAD) VLSI Process and Device Modeling, 1993. (1993 VPAD) 1993 International Workshop on. :96-97 1993

Relation: 1993 International Workshop on VLSI Process and Device Modeling

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