المؤلفون: Jian-Hsing Lee, Shih, J.R., Kuan, H.P., Kenneth Wu

المصدر: 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits (IPFA), 2010 17th IEEE International Symposium on the. :1-5 Jul, 2010

Relation: 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010)

المؤلفون: Kuan, H.P., Zhang, X.M.

المصدر: Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the. :52-55 2005

Relation: Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits

المؤلفون: Nam Sung Kim, Yang Bum Lee, Wong Wing Yew, Mukhopadhyay, M., Eng Keong Ho, Kuan, H.P., Shukla, D., Sang Hyun Han, Inn Swee Goh

المصدر: Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the. :38-42 2005

Relation: Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits

المؤلفون: Zhang, Y., Ang, D.S., Kuan, H.P., Tan, K.T.

المصدر: 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the. :75-79 Jul, 2006

Relation: 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits

المؤلفون: Li, Y.G., Tan, S.H., Kuan, H.P., Tan, K.T., Duan, L.J.

المصدر: 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on. :2190-2192 2006

Relation: 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings

المؤلفون: Jin, L.J., Kuan, H.P., Sim, D., Mukhopadhyay, M.

المصدر: 2008 15th International Symposium on the Physical & Failure Analysis of Integrated Circuits; 2008, p1-4, 4p

المؤلفون: Kuan, H.P., Zhang, X.M.

المصدر: Proceedings of the 12th International Symposium on the Physical & Failure Analysis of Integrated Circuits, 2005 (IPFA 2005); 2005, p52-55, 4p

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