يعرض 1 - 10 نتائج من 375 نتيجة بحث عن '"Kudo, Hiroshi"', وقت الاستعلام: 1.21s تنقيح النتائج
  1. 1
    مؤتمر
    Signal Integrity of 2-µm-Pitch RDL Interposer for High-Performance Signal Processing in Chiplet-Based System

    المؤلفون: Kudo, Hiroshi, Tanaka, Masaya, Takano, Takamasa, Kuramochi, Satoru, Togashi, Kazuyoshi, Yoshimi, Seiichi

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :531-536 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Panel-Based Large-Scale RDL Interposer Fabricated Using 2-μm-Pitch Semi-Additive Process for Chiplet-Based Integration

    المؤلفون: Kudo, Hiroshi, Takano, Takamasa, Tanaka, Masaya, Mawatari, Hiroshi, Kitayama, Daisuke, Tai, Takahiro, Tsunoda, Tsuyoshi, Kuramochi, Satoru

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :836-844 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  3. 3
    تقرير
    Transmission ERDA of ubiquitous deuterium in H-containing materials

    المؤلفون: Kudo, Hiroshi, Naramoto, Hiroshi, Sataka, Masao, Ishii, Satoshi, Sasa, Kimikazu, Tomita, Shigeo

    مصطلحات موضوعية: Condensed Matter - Materials Science

    URL الوصول: http://arxiv.org/abs/2304.00777

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  4. 4
    مؤتمر
    High-speed, High-density, and Highly-manufacturable Cu-filled Through-Glass-Via Channel (Cu bridge) for Multi-chiplet Systems

    المؤلفون: Kudo, Hiroshi, Takano, Takamasa, Akazawa, Miyuki, Yamada, Shouhei, Sakamoto, Kouji, Kitayama, Daisuke, Iida, Haruo, Tanaka, Masaya, Tai, Takahiro

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1031-1037 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Effectiveness of Inorganic Dielectric Layer on Submicron-scale Cu Traces against Thermal Oxidative Stress

    المؤلفون: Kudo, Hiroshi, Takano, Takamasa, Sakamoto, Kouji, Kitayama, Daisuke, Iida, Haruo, Tanaka, Masaya, Tai, Takahiro, Okazaki, Yumi, Suzuki, Jyunya, Maekawa, Shinji

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :353-358 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  6. 6
    تقرير
    Determination of hydrogen concentration in solids by transmission ERDA under nuclear-elastically enhanced recoiling of H by 8 and 9 MeV He

    المؤلفون: Kudo, Hiroshi, Kurosawa, Masanori, Naramoto, Hiroshi, Sataka, Masao, Ishii, Satoshi, Sasa, Kimikazu, Tomita, Shigeo

    مصطلحات موضوعية: Condensed Matter - Materials Science, Physics - Applied Physics

    URL الوصول: http://arxiv.org/abs/2206.02387

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  7. 7
    دورية أكاديمية
    Transmission ERDA of ubiquitous deuterium in H-containing materials

    المؤلفون: Kudo, Hiroshi, Naramoto, Hiroshi, Sataka, Masao, Ishii, Satoshi, Sasa, Kimikazu, Tomita, Shigeo

    المصدر: In Nuclear Inst. and Methods in Physics Research, B September 2024 554

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  8. 8
    مؤتمر
    Submicron-Scale Cu RDL Pattering Based on Semi-Additive Process for Heterogeneous Integration

    المؤلفون: Takano, Takamasa, Kudo, Hiroshi, Tanaka, Masaya, Akazawa, Miyuki

    المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :94-100 May, 2019

    Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    High-speed High-density Cost-effective Cu-filled Through-Glass-Via Channel for Heterogeneous Chip Integration

    المؤلفون: Kudo, Hiroshi, Akazawa, Miyuki, Yamada, Shouhei, Tanaka, Masaya, Iida, Haruo, Suzuki, Jyunya, Takano, Takamasa, Kuramochi, Satoru

    المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :104-109 Apr, 2019

    Relation: 2019 International Conference on Electronics Packaging (ICEP)

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  10. 10
    دورية أكاديمية
    I Can Do It Well Because I Did It Well: The Effect of Promoted Self-Efficacy through Induced Success Performance in Junior High School Students

    المؤلفون: Mori, Kazuo (ORCID 0000-0002-9631-5845), Kudo, Hiroshi

    المصدر: Contemporary School Psychology. Sep 2022 26(3):321-327.

    Peer Reviewed: Y

    Page Count: 7

    Descriptors: Self Efficacy, Academic Achievement, Junior High School Students, Intervention, Difficulty Level

    Find this article in full text from Springer Verlag. Find this article in full text from ProQuest Full Text Finder
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