المؤلفون: Duppala, Vijaya Raghava, Yadav Marepalli, Harika, S, Kirti Jain, Anusha, Koduru, Thangavel, Senthil Kumar, Kumar, B Senthil, Bindu, Avadhani, Satish, Latha, Sekar, Jeeva

المصدر: 2024 International Conference on Inventive Computation Technologies (ICICT) Inventive Computation Technologies (ICICT), 2024 International Conference on. :1315-1322 Apr, 2024

Relation: 2024 International Conference on Inventive Computation Technologies (ICICT)

المؤلفون: Chiong, Kenny, Sutiono, Sylvia, Kumar, B. Senthil, Miew Wan, Lo, Murali, Sarangapani, HanWen, Zhang, Sig, Kang Sung

المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :221-226 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Jason, Lim Chze Min, Kumar, B. Senthil, Sungsig, Kang, Huei, Yam Lip, Fen, Zhang Rui, Murali, Sarangapani

المصدر: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) Electronics Manufacturing Technology Conference (IEMT), 2022 IEEE 39th International. :1-5 Oct, 2022

Relation: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)

المؤلفون: Saniya, A., Divya, R., Sharmila, M., Kumar, Selvaraj Senthil, Kumar, B. Senthil^{Aff3, IDs13399024054263_cor5}

المصدر: Biomass Conversion and Biorefinery: Processing of Biogenic Material for Energy and Chemistry. :1-8

المؤلفون: Soundri, Geetha Margret, S., Kavitha, Kumar B., Senthil

المصدر: Research Journal of Textile and Apparel, 2022, Vol. 27, Issue 4, pp. 543-559.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/RJTA-05-2021-0074

المؤلفون: Huei, Yam Lip, Ting, Lo Yee, Hui, Chong Kim, Kumar, B. Senthil, Li-San, Chan, Fritzsche, Sebastian

المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :297-301 Dec, 2020

Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

المؤلفون: Kumar, B. Senthil, Danila, Bayaras Abito, Joanne, Chong Mei Hoe, Fen, Zhang Rui, Rath, Santosh Kumar, Li-San, Chan, Jason, Wong Chin Yeung

المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :733-737 Dec, 2019

Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

المؤلفون: Indumathi, T. R., Divya, R., Kumar, B. Senthil^{Aff3, IDs1339902304569z_cor3}, Selvakumar, A.

المصدر: Biomass Conversion and Biorefinery: Processing of Biogenic Material for Energy and Chemistry. :1-12

المؤلفون: Sindhuja, P. Princes, Kumar, B Senthil, Manic, K. Suresh

المصدر: 2016 IEEE International Conference on Computational Intelligence and Computing Research (ICCIC) Computational Intelligence and Computing Research (ICCIC), 2016 IEEE International Conference on. :1-4 Dec, 2016

Relation: 2016 IEEE International Conference on Computational Intelligence and Computing Research (ICCIC)

المؤلفون: Kumar B., Senthil, T., Murugan

المصدر: Research Journal of Textile and Apparel, 2021, Vol. 26, Issue 2, pp. 124-137.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/RJTA-04-2020-0032