المؤلفون: Ko, Jung-Soo, Zhang, Zichen, Lee, Sol, Jaikissoon, Marc, Bennett, Robert K. A., Kim, Kwanpyo, Kummel, Andrew C., Bandaru, Prabhakar, Pop, Eric, Saraswat, Krishna C.

المصدر: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2023 - IEEE 53rd European. :1-4 Sep, 2023

Relation: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)

المؤلفون: Wang, Victor, Kuo, Chenghsuan, Kanjolia, Ravindra, Moinpour, Mansour, Woodruff, Jacob, Simka, Harsono, Kummel, Andrew C.

المصدر: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023

Relation: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)

المؤلفون: Kuo, Cheng-Hsuan, Mcleod, Aaron J, Huang, James, Wang, Victor, Yun, SeongUK, Zhang, Zichen, Spiegelman, Jeffrey, Kummel, Andrew C.

المصدر: 2022 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2022 IEEE International. :76-78 Jun, 2022

Relation: 2022 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Zhang, Zichen, Passlack, Matthias^{Aff2, IDs41928023010472_cor2}, Pitner, Gregory, Natani, Shreyam, Su, Sheng-Kai, Chao, Tzu-Ang, Liew, San Lin, Hou, Vincent D.-H., Hsu, Chen-Feng, Shipley, Wade E., Safron, Nathaniel, Doornbos, Gerben, Lee, Tsung-En, Radu, Iuliana, Kummel, Andrew C., Bandaru, Prabhakar, Wong, H.-S. Philip

المصدر: Nature Electronics. 6(12):999-1008

المؤلفون: McLeod, Aaron J., Lee, Ping C., Ueda, Scott T., Devereaux, Zachary J., Winter, Charles H., Spiegelman, Jeff, Kanjolia, Ravindra, Moinpour, Mansour, Kummel, Andrew C.^{Aff1, IDs4357702300539y_cor9}

المصدر: MRS Bulletin. 48(11):1164-1171

المؤلفون: Kummel, Andrew C.

المصدر: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT) Technology, Systems and Applications (VLSI-TSA/VLSI-DAT), 2023 International VLSI Symposium on. :1-1 Apr, 2023

Relation: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)

المؤلفون: Bergschneider, Matthew, Ashburn, Nickolas, Lang, Xiuyao, Kummel, Andrew C., Cho, Kyeongjae^{Aff1, IDs43580022004821_cor5}

المصدر: MRS Advances. 8(14):768-772

المؤلفون: Kuo, Cheng-hsuan, Wang, Victor, Zhang, Zichen, Spiegelman, Jeffrey, Alvarez, Daniel, Kummel, Andrew C., Yun, SeongUK, Simka, Harsono

المصدر: 2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021

Relation: 2021 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Chae, Kisung, Kummel, Andrew C, Cho, Kyeongjae

المصدر: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2022 International Symposium on. :1-2 Apr, 2022

Relation: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)

المؤلفون: McLeod, Aaron J., Ueda, Scott T., Spiegelman, Jeff, Kummel, Andrew C.

المصدر: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2022 International Symposium on. :1-2 Apr, 2022

Relation: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)