يعرض 1 - 10 نتائج من 41 نتيجة بحث عن '"Kuramochi, Satoru"', وقت الاستعلام: 1.56s تنقيح النتائج
  1. 1
    مؤتمر
    Development of Glass core substrate with the stress analysis, transmission characteristics and reliability

    المؤلفون: Fujimoto, Koji, Okawa, Yashuhiro, Tai, Takahiro, Kuramochi, Satoru

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :546-550 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Experimental study of transmission signal performance of sub-2 micron fine-wiring with novel structure

    المؤلفون: Tanaka, Masaya, Moriwaki, Nobuyoshi, Kuramochi, Satoru

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1763-1767 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    High Speed Transmission Characteristics on Glass Based Interposers

    المؤلفون: Kuramochi, Satoru, Tanaka, Masaya, Tai, Takahiro

    المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-6 Sep, 2023

    Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

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  4. 4
    مؤتمر
    Signal Integrity of 2-µm-Pitch RDL Interposer for High-Performance Signal Processing in Chiplet-Based System

    المؤلفون: Kudo, Hiroshi, Tanaka, Masaya, Takano, Takamasa, Kuramochi, Satoru, Togashi, Kazuyoshi, Yoshimi, Seiichi

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :531-536 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Panel-Based Large-Scale RDL Interposer Fabricated Using 2-μm-Pitch Semi-Additive Process for Chiplet-Based Integration

    المؤلفون: Kudo, Hiroshi, Takano, Takamasa, Tanaka, Masaya, Mawatari, Hiroshi, Kitayama, Daisuke, Tai, Takahiro, Tsunoda, Tsuyoshi, Kuramochi, Satoru

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :836-844 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    High Frequency Characteristics of Glass Interposer

    المؤلفون: Tanaka, Masaya, Kuramochi, Satoru, Tai, Takahiro, Sato, Yoichiro, Kidera, Nobutaka

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :601-610 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    High-speed High-density Cost-effective Cu-filled Through-Glass-Via Channel for Heterogeneous Chip Integration

    المؤلفون: Kudo, Hiroshi, Akazawa, Miyuki, Yamada, Shouhei, Tanaka, Masaya, Iida, Haruo, Suzuki, Jyunya, Takano, Takamasa, Kuramochi, Satoru

    المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :104-109 Apr, 2019

    Relation: 2019 International Conference on Electronics Packaging (ICEP)

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  8. 8
    دورية أكاديمية
    Molybdenum oxide electrodeposition on boron-doped diamond: Investigation of valence state and application in electrochemical nitrogen reduction to ammonia

    المؤلفون: Kuramochi, Satoru, Fiorani, Andrea, Einaga, Yasuaki

    المصدر: In Diamond & Related Materials November 2023 139

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  9. 9
    مؤتمر
    Introduction of Sub-2-micron Cu traces to EnCoRe enhanced copper redistribution layers for heterogeneous chip integration

    المؤلفون: Kudo, Hiroshi, Aritsuka, Yuuki, Masaya, Tanaka, Kasai, Ryohei, Suyama, Jyunichi, Takeda, Mitsuhiro, Okazaki, Yumi, Iida, Haruo, Kitayama, Daisuke, Sakamoto, Kouji, Takano, Takamasa, Akazawa, Miyuki, Sato, Hiroaki, Yamada, Shouhei, Kuramochi, Satoru

    المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :399-404 Apr, 2018

    Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

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  10. 10
    مؤتمر
    Experimental study of through glass via effects on high frequency electrical characteristics

    المؤلفون: Tanaka, Masaya, Okazaki, Yumi, Suyama, Junichi, Kuramochi, Satoru, Han, Younggun, Horiuchi, Osamu, Katoh, Yoshihisa

    المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :184-188 Apr, 2018

    Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

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