يعرض 1 - 10 نتائج من 740 نتيجة بحث عن '"Kurashima, Y."', وقت الاستعلام: 0.92s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Performance Evaluation of MEMS Pirani Sensors With Differently Packaged Structures

    المؤلفون: Zhang, L., Lu, J., Kurashima, Y., Takagi, H.

    المصدر: IEEE Sensors Letters IEEE Sens. Lett. Sensors Letters, IEEE. 7(8):1-4 Aug, 2023

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  2. 2
    مؤتمر
    Optimizing activation process for strong direct bonding between diamond and Si substrates

    المؤلفون: Okita, S., Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Hayase, M.

    المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :261-262 Apr, 2023

    Relation: 2023 International Conference on Electronics Packaging (ICEP)

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  3. 3
    مؤتمر
    Efficient heat dissipation from β-Ga2O3 film directly bonded on diamond substrate

    المؤلفون: Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Watanabe, H., Ito, T., Higurashi, E.

    المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :99-100 May, 2022

    Relation: 2022 International Conference on Electronics Packaging (ICEP)

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  4. 4
    مؤتمر
    Development of Au/Pt/Ti multilayers for wafer-level packaging and residual gas gettering

    المؤلفون: Kariya, S., Matsumae, T., Kurashima, Y., Takagi, H., Hayase, M., Higurashi, E.

    المصدر: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :69-70 May, 2021

    Relation: 2021 International Conference on Electronics Packaging (ICEP)

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  5. 5
    مؤتمر
    Direct bonding of GaN and Si substrates using wet cleaning processes

    المؤلفون: Fukumoto, S., Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Hayase, M., Higurashi, E.

    المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :11-11 Oct, 2021

    Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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  6. 6
    مؤتمر
    Direct bonding of polycrystalline diamond substrate onto Si wafer under atmospheric conditions

    المؤلفون: Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Higurashi, E.

    المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :14-14 Oct, 2021

    Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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  7. 7
    مؤتمر
    Hydrophilic bonding of SiC substrate dipped in hydrofluoric acid with Ga2O3 film through atomically thin intermediate layer

    المؤلفون: Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Higurashi, E.

    المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :20-20 Oct, 2021

    Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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  8. 8
    مؤتمر
    GaN-HEMTs on Diamond Prepared by Room-Temperature Bonding Technology

    المؤلفون: Hiza, S., Shirayanagi, Y., Takiguchi, Y., Nishimura, K., Matsumae, T., Kurashima, Y., Higurashi, E., Takagi, H., Chayahara, A., Mokuno, Y., Yamada, H., Kasamura, K., Toyoda, H., Kubota, A., Yamamuka, M.

    المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :16-16 Oct, 2021

    Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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  9. 9
    مؤتمر
    Simplified vacuum packaging process by gas gettering using the Au/Ta/Ti metal bonding layer

    المؤلفون: Kariya, S., Matsumae, T., Kurashima, Y., Takagi, H., Hayase, M., Higurashi, E.

    المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :34-34 Oct, 2021

    Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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  10. 10
    مؤتمر
    Hydrophilic direct bonding of monocrystalline (111) diamond substrate onto Si wafer

    المؤلفون: Matsumae, T., Kurashima, Y., Umezawa, H., Takagi, H.

    المصدر: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :70-70 May, 2019

    Relation: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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