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1دورية أكاديمية
المؤلفون: Zhang, L., Lu, J., Kurashima, Y., Takagi, H.
المصدر: IEEE Sensors Letters IEEE Sens. Lett. Sensors Letters, IEEE. 7(8):1-4 Aug, 2023
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2مؤتمر
المؤلفون: Okita, S., Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Hayase, M.
المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :261-262 Apr, 2023
Relation: 2023 International Conference on Electronics Packaging (ICEP)
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3مؤتمر
المؤلفون: Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Watanabe, H., Ito, T., Higurashi, E.
المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :99-100 May, 2022
Relation: 2022 International Conference on Electronics Packaging (ICEP)
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4مؤتمر
المؤلفون: Kariya, S., Matsumae, T., Kurashima, Y., Takagi, H., Hayase, M., Higurashi, E.
المصدر: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :69-70 May, 2021
Relation: 2021 International Conference on Electronics Packaging (ICEP)
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5مؤتمر
المؤلفون: Fukumoto, S., Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Hayase, M., Higurashi, E.
المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :11-11 Oct, 2021
Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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6مؤتمر
المؤلفون: Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Higurashi, E.
المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :14-14 Oct, 2021
Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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7مؤتمر
المؤلفون: Matsumae, T., Kurashima, Y., Takagi, H., Umezawa, H., Higurashi, E.
المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :20-20 Oct, 2021
Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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8مؤتمر
المؤلفون: Hiza, S., Shirayanagi, Y., Takiguchi, Y., Nishimura, K., Matsumae, T., Kurashima, Y., Higurashi, E., Takagi, H., Chayahara, A., Mokuno, Y., Yamada, H., Kasamura, K., Toyoda, H., Kubota, A., Yamamuka, M.
المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :16-16 Oct, 2021
Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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9مؤتمر
المؤلفون: Kariya, S., Matsumae, T., Kurashima, Y., Takagi, H., Hayase, M., Higurashi, E.
المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :34-34 Oct, 2021
Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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10مؤتمر
المؤلفون: Matsumae, T., Kurashima, Y., Umezawa, H., Takagi, H.
المصدر: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :70-70 May, 2019
Relation: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)