المؤلفون: Kuwano, Genki^{Aff1, IDs10762024009969_cor1}, Kurihara, Kazuma, Hokari, Ryohei, Tojima, Yuya, Kinoshita, Moto

المصدر: Journal of Infrared, Millimeter, and Terahertz Waves. :1-12

المؤلفون: Hokari, Ryohei^{Aff1, IDs4159802340511z_cor1}, Takakuwa, Kyohei, Shiomoto, Kengo, Kuwano, Genki, Kurihara, Kazuma

المصدر: Scientific Reports. 13(1)

المؤلفون: Ata, Seisuke, Kurihara, Kazuma

المصدر: In Polymer 16 May 2024 302

المؤلفون: Yakabe, Sho, Watanabe, Takuro, Shimazu, Takayuki, Hokari, Ryohei, Kurihara, Kazuma

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1764-1769 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: Yakabe, Sho, Watanabe, Takuro, Shimazu, Takayuki, Hokari, Ryohei, Kurihara, Kazuma, Okabe, Shouhei

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1118-1123 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

المؤلفون: Hokari, Ryohei, Kurihara, Kazuma, Takada, Naoki, Matsumoto, Junichi, Matsumoto, Sohei, Hiroshima, Hiroshi

المصدر: 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Nano/Micro Engineered and Molecular Systems (NEMS), 2016 IEEE 11th Annual International Conference on. :388-391 Apr, 2016

Relation: 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

المؤلفون: Kurihara, Kazuma, Nagumo, Osamu, Takagi, Hideki, Maeda, Ryutaro

المصدر: 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on. :560-563 Jan, 2014

Relation: 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Kurihara, Kazuma, Takagi, Hideki, Maeda, Ryutaro

المصدر: 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on. :200-203 Apr, 2012

Relation: 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Ata, Seisuke, Yamada, Takeo, Hata, Kenji, Kurihara, Kazuma

المصدر: In Tribology International December 2020 152

المؤلفون: Hokari, Ryohei^Aff1, Takakuwa, Kyohei, Kato, Hirohisa, Yamamoto, Akitaka, Yamaguchi, Yusuke, Kurihara, Kazuma

المصدر: Scientific Reports. 11(1)