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Relation: 2024 31st International Conference on Mixed Design of Integrated Circuits and System (MIXDES)

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المصدر: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2023 IEEE Electrical Design of. :1-3 Dec, 2023

Relation: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

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المصدر: 2023 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO) Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2023 IEEE MTT-S International Conference on. :154-157 Jun, 2023

Relation: 2023 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)

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المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :960-966 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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Relation: 2022 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)

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Relation: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

المؤلفون: Dimple, Km, Guglani, Surila, Kumar, Rahul, Roy, Sourajeet, Kaushik, Brajesh Kumar, Kushwaha, Suyash, Sharma, Rohit

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :981-986 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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Relation: 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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