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1مؤتمر
المؤلفون: Lim, G.H., Kwan, H.F., Shi, X.Q.
المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :578-583 2003
Relation: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)
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2دورية أكاديمية
المؤلفون: Shi, X.Q., Kwan, H.F., Nai, S.M.L., Lim, G.H.
المصدر: Journal of Materials Science; Feb2004, Vol. 39 Issue 3, p1095-1099, 5p
مصطلحات موضوعية: INTERMETALLIC compounds, METALS, SOLDER & soldering, MATERIAL fatigue, MATERIALS science
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