المؤلفون: Gu, X., Liu, D., Baks, C., Tageman, O., Sadhu, B., Hallin, J., Rexberg, L., Parida, P., Kwark, Y., Valdes-Garcia, A.

المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 67(7):2975-2984 Jul, 2019

المؤلفون: Dickson, T. O., Liu, Y., Rylov, S. V., Agrawal, A., Kim, S., Hsieh, P.-H., Bulzacchelli, J. F., Ferriss, M., Ainspan, H. A., Rylyakov, A., Parker, B. D., Beakes, M. P., Baks, C., Shan, L., Kwark, Y., Tierno, J. A., Friedman, D. J.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 50(8):1917-1931 Aug, 2015

المؤلفون: Zhang, Y.-J., Ren, L., Liu, D., De, S., Gu, X., Kwark, Y. H., Schuster, C., Fan, J.

المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 63(3):883-890 Mar, 2015

المؤلفون: Rimolo-Donadio, R., Baks, C., Lee, B. G., Song, J. H., Gu, X., Kwark, Y. H., Kuchta, D. M., Rylyakov, A. V., Schow, C. L.

المصدر: 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on. :55-58 Oct, 2012

Relation: 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

المؤلفون: Han, K. J., Gu, X., Kwark, Y. H., Shan, L., Ritter, M. B.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 4(2):268-278 Feb, 2014

المؤلفون: Meghelli, M., Rylov, S., Bulzacchelli, J., Rhee, W., Rylyakov, A., Ainspan, H., Parker, B., Beakes, M., Chung, A., Beukema, T., Pepeljugoski, P., Shan, L., Kwark, Y., Gowda, S., Friedman, D.

المصدر: 2006 IEEE International Solid State Circuits Conference - Digest of Technical Papers Solid-State Circuits Conference, 2006. ISSCC 2006. Digest of Technical Papers. IEEE International. :213-222 2006

Relation: 2006 IEEE International Solid State Circuits Conference

المؤلفون: Kuchta, D., Baks, C., Kwark, Y., Mintarno, E., de Araujo, D.N., Cases, M., Matoglu, E., Pham, N.

المصدر: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Electrical Performance of Electronic Packaging Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on. :15-18 2005

Relation: Electrical Performance of Electronic Packaging

المؤلفون: Kaller, D., Schuster, C., Kwark, Y., Altabella, D., Bao Truong, Zhaoqing Chen, Haridass, A., Klink, E.

المصدر: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Electrical Performance of Electronic Packaging Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on. :95-98 2005

Relation: Electrical Performance of Electronic Packaging

المؤلفون: Seongwon Kim, Kapur, M., Meghelli, M., Rylyakov, A., Kwark, Y., Friedman, D.

المصدر: Proceedings of the IEEE 2003 Custom Integrated Circuits Conference, 2003. Custom integrated circuits Custom Integrated Circuits Conference, 2003. Proceedings of the IEEE 2003. :313-316 2003

Relation: CICC Custom Integrated Circuits Conference

المؤلفون: Kotzev, M., Rimolo-Donadio, R., Kwark, Y. H., Baks, C. W., Gu, X., Schuster, C.

المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 61(12):3198-3206 Dec, 2012