المؤلفون: Chul-Won Ju, Kyu-Ha Pack, Hee-Tae Lee, Eun-Su Nam, Kyoung-lk Joe

المصدر: 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :1572-1575 2003

Relation: 53rd Electronic Components and Technology Conference, 2003. Proceedings.

المؤلفون: Chul-Won Ju, Seong-Jin Kim, Kyu-Ha Pack, Hee-Tae Lee, Young-Chul Hyun, Seong-Su Park

المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1178-1181 2002

Relation: Proceedings of 52nd Electronic Components and Technology Conference

المؤلفون: Chul-Won Ju, Seong-Su Park, Seong-Jin Kim, Kyu-Ha Pack, Hee-Tae Lee, Min-Kyu Song

المصدر: 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Electronic components and technology Electronic Components and Technology Conference, 2001. Proceedings., 51st. :1216-1218 2001

Relation: 51st Electronic Components and Technology Conference 2001. Proceedings

المؤلفون: Hee-Tae Lee, Eun-Su Nam, Chul-Won Ju, Kyu-Ha Pack, Kyoung-lk Joe

المصدر: 53rd Electronic Components and Technology Conference, 2003. Proceedings..

مصطلحات موضوعية: Optical amplifier, Wire bonding, Interconnection, Wafer-scale integration, Materials science, business.industry, Chip-scale package, Electrical engineering, Return loss, Optoelectronics, Wafer, business, Common emitter

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::db5c9d09bdec63a044d80bd058b41edd
https://doi.org/10.1109/ectc.2003.1216507

المؤلفون: Seong-Su Park, Young-Chul Hyun, Kyu-Ha Pack, Hee-Tae Lee, Chul-Won Ju, Seong-Jin Kim

المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

مصطلحات موضوعية: Reflow soldering, Materials science, Resist, Soldering, Electronic packaging, Electronic engineering, Wafer, Composite material, Electroplating, Wafer-level packaging, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::94344f3ff2ae558cb2ca07415335284e
https://doi.org/10.1109/ectc.2002.1008255

المؤلفون: Hee-Tae Lee, Chul-Won Ju, Seong-Su Park, Min-Kyu Song, Seong-Jin Kim, Kyu-Ha Pack

المصدر: 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

مصطلحات موضوعية: Auger electron spectroscopy, Plasma etching, Microscope, Argon, Materials science, Scanning electron microscope, Analytical chemistry, chemistry.chemical_element, Substrate (electronics), law.invention, chemistry, law, Wafer, Layer (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7a96dcb9275995ba7ba29973b5384bbe
https://doi.org/10.1109/ectc.2001.927983

المؤلفون: Chul-Won Ju, Seong-Su Park, Seong-Jin Kim, Kyu-Ha Pack, Hee-Tae Lee, Min-Kyu Song

المصدر: 2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p1216-1218, 3p