المؤلفون: Punch, J., Grimes, R., Heaslip, G., Galkin, T., Vakevainen, K., Kyyhkynen, V., Elonen, E.

المصدر: EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. Thermal mechanical and multi-physics simulation and experiments in micro-electronics and micro-syste Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on. :398-405 2005

Relation: Thermal Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

المؤلفون: Kyyhkynen, V., Valtanen, J., Ristolainen, E.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 27(1):117-123 Mar, 2004

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لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.