نتائج البحث - "L. Economikos"

1

High performance 14nm SOI FinFET CMOS technology with 0.0174µm2 embedded DRAM and 15 levels of Cu metallization

المؤلفون: E. Engbrecht, Edward P. Maciejewski, Christopher D. Sheraw, R. Divakaruni, Zhengwen Li, Allen H. Gabor, L. Economikos, Fernando Guarin, N. Zhan, H-K Lee, MaryJane Brodsky, Kenneth J. Stein, Siyuranga O. Koswatta, Y. Yang, Byeong Y. Kim, J. Hong, A. Bryant, Herbert L. Ho, Ruqiang Bao, Nicolas Breil, Babar A. Khan, E. Woodard, W-H. Lee, C-H. Lin, A. Levesque, Kevin McStay, V. Basker, Viraj Y. Sardesai, C. Tran, A. Ogino, Reinaldo A. Vega, C. DeWan, Shreesh Narasimha, J-J. An, Amit Kumar, A. Aiyar, Ravikumar Ramachandran, W. Wang, X. Wang, W. Nicoll, D. Hoyos, A. Friedman, Barry Linder, Yongan Xu, E. Alptekin, Cathryn Christiansen, S. Polvino, Han Wang, Scott R. Stiffler, G. Northrop, S. Saudari, J. Rice, Saraf Iqbal Rashid, Sunfei Fang, Michael V. Aquilino, Z. Ren, B. Kannan, Geng Wang, Noah Zamdmer, T. Kwon, Paul D. Agnello, Hasan M. Nayfeh, S. Jain, Robert R. Robison, M. Hasanuzzaman, J. Cai, L. Lanzerotti, D. Wehelle-Gamage, Basanth Jagannathan, J. Johnson, E. Kaste, Kai Zhao, Huiling Shang, Carl J. Radens, Shariq Siddiqui, Y. Ke, D. Ferrer, Ximeng Guan, D. Conklin, K. Boyd, K. Henson, Siddarth A. Krishnan, Bernard A. Engel, H. Dong, S. Mahajan, Unoh Kwon, Dominic J. Schepis, William Y. Chang, Liyang Song, Brian J. Greene, Chengwen Pei, S.-J. Jeng, Clevenger Leigh Anne H, Vijay Narayanan, C. Zhu, Wai-kin Li, Henry K. Utomo, Wei Liu, Dureseti Chidambarrao

المصدر: 2014 IEEE International Electron Devices Meeting.

مصطلحات موضوعية: Engineering, Subthreshold conduction, business.industry, Processor design, Copper interconnect, Soi finfet, Hardware_PERFORMANCEANDRELIABILITY, Thread (computing), Planar, CMOS, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, business, Dram

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6233530b0b3fd6ddc14276a018716523
https://doi.org/10.1109/iedm.2014.7046977

2

Design optimization of a laser bond tool

المؤلفون: R. Sherif, L. Economikos

المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 19:234-239

مصطلحات موضوعية: Materials science, Laser safety, business.industry, General Engineering, Structural engineering, Laser, law.invention, Stress (mechanics), Cracking, law, Laser power scaling, Tape-automated bonding, Composite material, business, Thermal energy, Diffusion bonding

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::aa1d5759df64de3d65e825b0cbce7239
https://doi.org/10.1109/95.506109

3

Open repair technologies for MCM-D

المؤلفون: L. Economikos, Thomas A. Wassick

المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 18:154-162

مصطلحات موضوعية: Wire bonding, Materials science, Soldering, General Engineering, Electronic engineering, Open repair, Ultrasonic soldering, Nanotechnology, Integrated circuit packaging, Chemical vapor deposition, Thin film, IBM

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0df8346def6be6aa79a53e26402fd158
https://doi.org/10.1109/96.365502

4

Computer vision for automatic inspection of complex metal patterns on multichip modules (MCM-D)

المؤلفون: M.E. Scaman, L. Economikos

المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 18:675-684

مصطلحات موضوعية: Resistive touchscreen, Engineering, business.industry, Transistor, General Engineering, Volume (computing), Image processing, Integrated circuit, law.invention, Reduction (complexity), law, Computer-aided manufacturing, Pattern recognition (psychology), Electronic engineering, Computer vision, Artificial intelligence, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::da20b1790cd173c8b6b61e3ffc553b3a
https://doi.org/10.1109/96.475274

5

High performance bulk planar 20nm CMOS technology for low power mobile applications

المؤلفون: Eduard A. Cartier, X. Chen, Pierre Malinge, L. Kang, T. Watanabe, Michael P. Belyansky, L. Economikos, O. Menut, Vijay Narayanan, C. Reddy, R. Divakaruni, Y.H. Park, Ravi Prakash Srivastava, M. Pallachalil, R. Koshy, Dominic J. Schepis, P. Montanini, Keith Kwong Hon Wong, M. Eller, Park Sejun, A. Ogino, H. Mallela, U. Kwon, T. Shimizu, W. Cote, Jay W. Strane, Srikanth Samavedam, M. Chae, Anurag Mittal, R. Sampson, J. Meiring, R. Joy, Huiling Shang, S. Soss, X. Yang, Keith H. Tabakman, M. Oh, W. Lai, C. Tran, S. Jain, E. Josse, D. Codi, H.V. Meer, B.Y. Kim, Jung-Geun Kim, Jin Bum Kim, C. Goldberg, Henry K. Utomo, J. Ciavatti, Barry Linder, R. Vega, W. Neumueller, J. Muncy, Kyung-hwan Cho, Scott J. Bukofsky, Alvin G. Thomas, Dinesh Koli, Katherina Babich, Bomi Kim, S. Lian, E. Alptekin, Y. Liu, S. H. Rhee, X. Wu, R. Arndt, W.L. Tan, Frederic Lalanne, Nam-Sung Kim, Ravikumar Ramachandran, K.Y. Lee, M.H. Nam, Randy W. Mann, Il-Ryong Kim, Yujun Li, V. Sardesai, Siddarth A. Krishnan, C. Tian, D. Levedakis, Seung-Kwon Kim, Jedon Kim, M. Celik, F. Matsuoka, M. Weybright, J. Sudijono, M. Aminpur, B. Hamieh, Greg Northrop, J.W. Lee

المصدر: 2012 Symposium on VLSI Technology (VLSIT).

مصطلحات موضوعية: Engineering, business.industry, Electrical engineering, Hardware_PERFORMANCEANDRELIABILITY, Planar, Strain engineering, CMOS, Logic gate, Hardware_INTEGRATEDCIRCUITS, Static random-access memory, business, Metal gate, Standby power, Leakage (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0ec874734f9fcf487e547466890b1297
https://doi.org/10.1109/vlsit.2012.6242495

6

Computer vision for automatic inspection of a high density grid of pads on multi-chip modules (MCM-D)

المؤلفون: M.E. Seaman, J. Lambright, L. Economikos

المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 17:291-299

مصطلحات موضوعية: Automated optical inspection, Visual inspection, Engineering drawing, Engineering, business.industry, General Engineering, Computer vision, Artificial intelligence, business, Chip, Grid

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ed6af6c5bd2ee7486d87fa1b10273871
https://doi.org/10.1109/96.311776

7

Electrical test of multichip substrates

المؤلفون: T. Morrison, L. Economikos, F. Crnic

المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 17:56-61

مصطلحات موضوعية: Interconnection, Engineering, business.industry, Interface (computing), General Engineering, Electrical engineering, Substrate (printing), Capacitance, Reliability (semiconductor), Cluster (physics), Optoelectronics, Thin film, business, Beam (structure)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8f7ff2184841d5bbd0545875a2fc5f0c
https://doi.org/10.1109/96.296431

8

A 45 nm CMOS node Cu/Low-k/ Ultra Low-k PECVD SiCOH (k=2.4) BEOL Technology

المؤلفون: Eva E. Simonyi, William F. Landers, T. H. Ivers, Thomas M. Shaw, K. Ida, D. Jung, Sujatha Sankaran, Kaushal Patel, Johnny Widodo, Naftali E. Lustig, M. Chae, Kaushik Chanda, G. A. Biery, Wan-jae Park, J. Sucharitaves, W. Liu, T. Ko, Christos D. Dimitrakopoulos, M. Kelling, Stephen M. Gates, R. G. Filippi, D. Nielsen, John A. Fitzsimmons, O. Bravo, M. Beck, Satya V. Nitta, Terry A. Spooner, L. Economikos, T. Bolom, Alfred Grill, John G. Pellerin, X. Liu, Eric G. Liniger, G. Matusiewicz, E. Kaltalioglu, C. Tian, Mukta G. Farooq, F. Chen, David L. Rath, Griselda Bonilla, D. Nguyen, Nicholas C. M. Fuller, P. Davis, S. Arai, Daniel C. Edelstein, J.P. Doyle, Kevin S. Petrarca, P. Ong, Kaushik A. Kumar, H. Wendt, L. Wiggins, V. Patel, Stephan Grunow, W. Li, L. Nicholson, I. Melville, Sanjay Mehta, Stephen E. Greco, J. Werking, Robert L. Wisnieff, B. Moon, Darryl D. Restaino, S. Marokkey, R. Hannon, Myoung-Bum Lee, Theodorus E. Standaert, Shom Ponoth, Paul S. McLaughlin, R. Augur, P. V. McLaughlin, C. Labelle, A. Cowley, H. Shoba, S. Rhee, K. Malone, Stephan A. Cohen, Michael Lane, E.T. Ryan, H. Landis, Larry Clevenger, James R. Lloyd, James J. Demarest, Andrew H. Simon, K. Miyata

المصدر: 2006 International Electron Devices Meeting.

مصطلحات موضوعية: Back end of line, Reliability (semiconductor), Materials science, CMOS, Homogeneous, business.industry, Plasma-enhanced chemical vapor deposition, Electronic engineering, Copper interconnect, Optoelectronics, Node (circuits), Parasitic extraction, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::78f866f42f2dc1939f7fea86854709e4
https://doi.org/10.1109/iedm.2006.346782

9

Applications of Latent Open Test

المؤلفون: L. Economikos, Shinwu Chiang, A. Halperin

المصدر: Proceedings of the International Conference on Multichip Modules.

مصطلحات موضوعية: Wire bonding, Engineering, business.industry, law, Electronic engineering, Process control, STRIPS, business, Electrical conductor, law.invention

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6689aae4c42f0efcfe59fbbaf0a6bf28
https://doi.org/10.1109/icmcm.1994.753552

10

Implementation of Advanced Micro-Interconnection Technologies on a Thin-Film Multichip Module

المؤلفون: K. F. Beckham, H. M. Clearfield, M. J. Interrante, L. Economikos

المصدر: Proceedings of the International Conference on Multichip Modules.

مصطلحات موضوعية: Interconnection, Materials science, business.industry, law, Fiber laser, Transistor, Optoelectronics, Thin film, business, Flip chip, law.invention

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d0ce6ad953069bbaa3c78fc8b8574ead
https://doi.org/10.1109/icmcm.1994.753531

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