المؤلفون: P. R. A. Binetti, X. J. M. Leijtens, T. de Vries, Y. S. Oei, L. Di Cioccio, J.-M. Fedeli, C. Lagahe, J. Van Campenhout, D. Van Thourhout, P. J. van Veldhoven, R. Nötzel, M. K. Smit

المصدر: IEEE Photonics Journal, Vol 2, Iss 3, Pp 299-305 (2010)

مصطلحات موضوعية: Optical interconnects, photodetector, Applied optics. Photonics, TA1501-1820, Optics. Light, QC350-467

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/5437284/; https://doaj.org/toc/1943-0655

URL الوصول: https://doaj.org/article/b81d9a6450cb41389cbb9bef34e6a7aa

المؤلفون: C. Masante, J. de Vecchy, F. Mazen, F. Milesi, L. Di Cioccio, J. Pernot, F. Lloret, D. Araujo, J.C. Pinero, N. Rochat, F. Pierre, F. Servant, J. Widiez

المساهمون: Département Composants Silicium (DCOS), Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Semi-conducteurs à large bande interdite (NEEL - SC2G), Institut Néel (NEEL), Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP ), Université Grenoble Alpes (UGA)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP ), Université Grenoble Alpes (UGA), University of Cadiz, ANR-19-CE05-0025,TRANS-DIAM,Transfert de couches de diamant monocristallin pour les applications de puissance(2019)

المصدر: Diamond and Related Materials
Diamond and Related Materials, 2022, 126, pp.109085. ⟨10.1016/j.diamond.2022.109085⟩

مصطلحات موضوعية: Mechanical Engineering, Materials Chemistry, General Chemistry, [CHIM.MATE]Chemical Sciences/Material chemistry, Electrical and Electronic Engineering, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, Electronic, Optical and Magnetic Materials, [SPI.TRON]Engineering Sciences [physics]/Electronics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::70affd3371ee9448f20010637dba3f09
https://cea.hal.science/cea-03714349

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المؤلفون: Joel Cibert, L. Di Cioccio, A. Million, S. Tararenko, Guy Feuillet

المصدر: Microscopy of Semiconducting Materials, 1987

مصطلحات موضوعية: Materials science, business.industry, Interface (Java), Optoelectronics, business, Epitaxy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7bd530952af6f51571eaf800186cdcc8
https://doi.org/10.1201/9781003069621-22

المؤلفون: V. Balan, Yann Henrion, D. Bouchu, J. Jourdon, Severine Cheramy, Stephane Moreau, L. Di Cioccio, P. Lamontagne, Frank Fournel, Lucile Arnaud, A. Jouve, Sandrine Lhostis

المصدر: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).

مصطلحات موضوعية: Robustness (computer science), Computer science, Reliability engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::de16679d1f68afdc2b4845abd43a46e7
https://doi.org/10.23919/ltb-3d.2019.8735353

المؤلفون: Kremena Vladimirova, A. Cibie, L. Di Cioccio, Julie Widiez, J. de Vecchy

المصدر: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).

مصطلحات موضوعية: Materials science, Silicon, business.industry, Wafer bonding, Diamond, chemistry.chemical_element, Gallium nitride, engineering.material, chemistry.chemical_compound, chemistry, Key (cryptography), engineering, Silicon carbide, Optoelectronics, Power semiconductor device, Stage (hydrology), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1797a71e6117f64ca75bda5cc6b71292
https://doi.org/10.23919/ltb-3d.2019.8735401

المؤلفون: Julie Widiez, Jose Carlos Piñero, Daniel Araujo, G. Alba, J. de Vecchy, D. Fernández, L. Di Cioccio, Fernando Lloret, Julien Pernot

المساهمون: Universidad de Cádiz (UCA), Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Semi-conducteurs à large bande interdite (NEEL - SC2G), Institut Néel (NEEL), Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP ), Université Grenoble Alpes (UGA)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP ), Université Grenoble Alpes (UGA)

المصدر: Applied Surface Science
Applied Surface Science, 2020, 528, pp.146998. ⟨10.1016/j.apsusc.2020.146998⟩

مصطلحات موضوعية: Materials science, Silicon, General Physics and Astronomy, chemistry.chemical_element, 02 engineering and technology, engineering.material, 010402 general chemistry, 01 natural sciences, Lattice (order), Wafer, Power semiconductor device, Diamond cubic, [PHYS]Physics [physics], Schottky diode, Diamond, Surfaces and Interfaces, General Chemistry, 021001 nanoscience & nanotechnology, Condensed Matter Physics, Engineering physics, 0104 chemical sciences, Surfaces, Coatings and Films, chemistry, engineering, 0210 nano-technology, Smart Cut

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d0b82455e9eb5b769e8b2ebb755c4392
https://doi.org/10.1016/j.apsusc.2020.146998

المؤلفون: L. Di Cioccio, A. Jouve, S. Cheramy, Claire Fenouillet-Beranger, P. Vivet

المصدر: 3D Integration in VLSI Circuits ISBN: 9781315200699

مصطلحات موضوعية: Materials science, High density, Molecular physics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e7d4216b7a40b90657b172f96168343f
https://doi.org/10.1201/9781315200699-7

المؤلفون: Paul R. Chalker, Ruiyang Yu, Marleen Van Hove, Geoff Haynes, Enrico Zanoni, Jie Hu, Xu Li, Hiroshi Amano, Daniel Piedra, Hiroji Kawai, Min Sun, Martin Kuball, Qingyun Huang, L. Di Cioccio, Carlo De Santi, Rongming Chu, Matthew Charles, Yuhao Zhang, Rekha Reddy, Erwan Morvan, Joseph J. Freedsman, Akira Nakajima, Tomas Palacios, Thomas Heckel, Denis Marcon, Shu Yang, Stephen Oliver, A. Torres, Oliver Häberlen, Stefan Zeltner, Dan Kinzer, Marc Plissonnier, Vineet Unni, Iain G. Thayne, Gaudenzio Meneghesso, Patrick Fay, David J. Wallis, Mengyuan Hua, Chris Youtsey, Shuichi Yagi, Sheng Jiang, Alex Q. Huang, Louis J. Guido, Matteo Meneghini, Ashwani Kumar, Jingshan Wang, Dilini Hemakumara, Nicola Trivellin, Martin Marz, Jinqiao Xie, Nadim Chowdhury, Maria Merlyne De Souza, T Bouchet, Michael J. Uren, Bernd Eckardt, Ekkanath Madathil Sankara Narayanan, Peter A. Houston, K. B. Lee, Matteo Borga, Yannick Baines, Takashi Egawa, Robert McCarthy, Stefaan Decoutere, Kevin J. Chen

المساهمون: Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology. Microsystems Technology Laboratories, Zhang, Yuhao, Hu, Jie, Palacios, Tomas, Piedra, Daniel, Sun, Min, Publica

المصدر: Journal of Physics D: Applied Physics
Amano, H, Baines, Y, Beam, E, Borga, M, Bouchet, T, Chalker, P R, Charles, M, Chowdhury, N, Chu, R, De Santi, C, De Souza, M M, Decoutere, S, Di Cioccio, L, Eckardt, B, Egawa, T, Freedsman, J J, Guido, L, Häberlen, O, Haynes, G, Heckel, T, Hemakumara, D, Houston, P, Hu, J, Hua, M, Huang, Q, Huang, A, Jiang, S, Kawai, H, Kinzer, D, Kuball, M, Kumar, A, Lee, K B, Li, X, Marcon, D, März, M, McCarthy, R, Meneghesso, G, Meneghini, M, Morvan, E, Nakajima, A, Narayanan, E M S, Oliver, S, Palacios, T, Piedra, D, Plissonnier, M, Reddy, R, Sun, M, Thayne, I, Torres, A, Trivellin, N, Unni, V, Uren, M J, Van Hove, M, Wallis, D J, Xie, J, Yagi, S, Yang, S, Youtsey, C, Yu, R, Zanoni, E, Zeltner, S & Zhang, Y 2018, ' The 2018 GaN power electronics roadmap ', Journal of Physics D: Applied Physics, vol. 51, no. 16, 163001 . https://doi.org/10.1088/1361-6463/aaaf9d
Zhang, Yuhao

مصطلحات موضوعية: Electron mobility, power circuits, Acoustics and Ultrasonics, Computer science, Gallium nitride, 02 engineering and technology, Network topology, 01 natural sciences, law.invention, GaN, Coatings and Films, chemistry.chemical_compound, law, Power electronics, 0103 physical sciences, Electronic, CDTR, GaN-on-Si, Electronic, Optical and Magnetic Materials, Condensed Matter Physics, Surfaces, Coatings and Films, Optical and Magnetic Materials, Road map, 010302 applied physics, business.industry, Transistor, 021001 nanoscience & nanotechnology, Engineering physics, Surfaces, chemistry, Diminishing returns, Photonics, 0210 nano-technology, business

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::50811b783af097d245ba2ba5b70676cb

المؤلفون: Perceval Coudrain, Guillaume Parry, Patrick McGarry, L. Di Cioccio, Yann Beilliard, Rafael Estevez

المساهمون: Science et Ingénierie des Matériaux et Procédés (SIMaP ), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes [2016-2019] (UGA [2016-2019]), Dept. Mech.&BIomed. Engn. Galway, Dept. Mech & Biomed Engn Galway, Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), STMicroelectronics

المصدر: International Journal of Solids and Structures
International Journal of Solids and Structures, Elsevier, 2017, 117, pp.208-220. ⟨10.1016/j.ijsolstr.2016.02.041⟩
International Journal of Solids and Structures, 2017, 117, pp.208-220. ⟨10.1016/j.ijsolstr.2016.02.041⟩

مصطلحات موضوعية: Materials science, Annealing (metallurgy), 020209 energy, chemistry.chemical_element, Polishing, 02 engineering and technology, Direct bonding, 01 natural sciences, [SPI.MAT]Engineering Sciences [physics]/Materials, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Miniaturization, General Materials Science, Composite material, ComputingMilieux_MISCELLANEOUS, 010302 applied physics, business.industry, Applied Mathematics, Mechanical Engineering, Structural engineering, [CHIM.MATE]Chemical Sciences/Material chemistry, Condensed Matter Physics, Copper, Finite element method, Nonlinear system, Contact mechanics, chemistry, Mechanics of Materials, Modeling and Simulation, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c09bf98a7d68432918ce81757b3aefd9
https://hal.archives-ouvertes.fr/hal-01685170