المؤلفون: Jin, Wenjing, Gong, Jeonghun, Lee, Jae W.

المصدر: 2024 International Technical Conference on Circuits/Systems, Computers, and Communications (ITC-CSCC) Circuits/Systems, Computers, and Communications (ITC-CSCC), 2024 International Technical Conference on. :1-6 Jul, 2024

Relation: 2024 International Technical Conference on Circuits/Systems, Computers, and Communications (ITC-CSCC)

المؤلفون: Lee, Hyunseung, Hong, Jihoon, Kim, Soosung, Lee, Seung Yul, Lee, Jae W.

المصدر: 2023 60th ACM/IEEE Design Automation Conference (DAC) Design Automation Conference (DAC), 2023 60th ACM/IEEE. :1-6 Jul, 2023

Relation: 2023 60th ACM/IEEE Design Automation Conference (DAC)

المؤلفون: Park, Yeonhong, Hyun, Jake, Cho, SangLyul, Sim, Bonggeun, Lee, Jae W.

مصطلحات موضوعية: Computer Science - Machine Learning

URL الوصول: http://arxiv.org/abs/2402.10517

المؤلفون: Grasset, Eloïse M.^{Aff1, Aff2, Aff3, IDs41388024031279_cor1}, Deshpande, Atul^{Aff4, Aff5, Aff6}, Lee, Jae W.^{Aff4, Aff7}, Cho, Yeonju, Shin, Sarah M., Coyne, Erin M., Hernandez, Alexei, Yuan, Xuan, Zhang, Zhehao, Cimino-Mathews, Ashley^{Aff4, Aff7}, Ewald, Andrew J.^{Aff3, Aff4, Aff5, Aff8}, Ho, Won Jin^{Aff4, Aff5, IDs41388024031279_cor12}

المصدر: Oncogene. 43(39):2927-2937

المؤلفون: Shin, Hoon, Park, Rihae, Lee, Jae W.

المصدر: 2023 International Technical Conference on Circuits/Systems, Computers, and Communications (ITC-CSCC) Circuits/Systems, Computers, and Communications (ITC-CSCC), 2023 International Technical Conference on. :1-6 Jun, 2023

Relation: 2023 International Technical Conference on Circuits/Systems, Computers, and Communications (ITC-CSCC)

المؤلفون: Stone, Meredith L.^{Aff1, Aff2}, Lee, Jesse^{Aff1, Aff2}, Lee, Jae W.^{Aff1, Aff2, Aff4}, Coho, Heather^{Aff1, Aff2}, Tariveranmoshabad, Mito^{Aff1, Aff2}, Wattenberg, Max M.^{Aff1, Aff2}, Choi, Hana^{Aff1, Aff2}, Herrera, Veronica M.^{Aff1, Aff2}, Xue, Yuqing^{Aff1, Aff2}, Choi-Bose, Shaanti^{Aff1, Aff2}, Zingone, Sofia K.^{Aff1, Aff2}, Patel, Dhruv^{Aff1, Aff2}, Markowitz, Kelly^{Aff1, Aff2}, Delman, Devora^{Aff1, Aff2}, Balachandran, Vinod P., Beatty, Gregory L.^{Aff1, Aff2, IDs41590024018201_cor16}

المصدر: Nature Immunology. 25(5):755-763

المؤلفون: Lee, Minbeom, Lyu, Jimin, Lee, Jae W.^{Aff1, IDs11814024000972_cor3}, Kang, Dohyung^{Aff2, IDs11814024000972_cor4}

المصدر: Korean Journal of Chemical Engineering. 41(5):1479-1490

المؤلفون: Yoshizawa, Tadashi^{Aff1, Aff2}, Lee, Jae W., Hong, Seung-Mo^{Aff1, Aff3}, Jung, DongJun^{Aff1, Aff4}, Noë, Michaël, Zbijewski, Wojciech, Kiemen, Ashley, Wu, Pei-Hsun, Wirtz, Denis^{Aff1, Aff7}, Hruban, Ralph H.^{Aff1, Aff5}, Wood, Laura D.^{Aff1, Aff5}, Oshima, Kiyoko^{Aff1, IDs00428023036413_cor12}

المصدر: Virchows Archiv: European Journal of Pathology. 484(5):753-763

المؤلفون: Seo, Seong Hoon, Kim, Soosung, Jung, Sung Jun, Kwon, Sangwoo, Lee, Hyunseung, Lee, Jae W.

المصدر: ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC) Solid State Circuits Conference (ESSCIRC), ESSCIRC 2022- IEEE 48th European. :85-88 Sep, 2022

Relation: ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)

المؤلفون: Lee, Yejin, Choi, Hyunji, Min, Sunhong, Lee, Hyunseung, Beak, Sangwon, Jeong, Dawoon, Lee, Jae W., Ham, Tae Jun

المصدر: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA) HPCA High-Performance Computer Architecture (HPCA), 2022 IEEE International Symposium on. :169-183 Apr, 2022

Relation: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA)