يعرض 1 - 10 نتائج من 1,035 نتيجة بحث عن '"LGA"', وقت الاستعلام: 1.42s تنقيح النتائج
  1. 1
    مؤتمر
    Large package body size scaling with two novel technologies: Multi Ball BGA and Liquid Metal Interconnect

    المؤلفون: Lu, Xiao, Wu, Jiaqi, Lee, Sangeon, Meyyappan, Karumbu

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1293-1297 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Investigation of Different Hot Bar Soldering Modes for Obtaining Strong Solders by Statistical Methods

    المؤلفون: Peshev, Nedyalko, Tsenev, Valentin

    المصدر: 2023 8th International Conference on Smart and Sustainable Technologies (SpliTech) Smart and Sustainable Technologies (SpliTech), 2023 8th International Conference on. :1-5 Jun, 2023

    Relation: 2023 8th International Conference on Smart and Sustainable Technologies (SpliTech)

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  3. 3
    مؤتمر
    Investigating the Effect of Solder Material Quantity on Obtaining Strong Solder Joints in LGA Type Assembly Using Statistics

    المؤلفون: Peshev, Nedyalko, Tsenev, Valentin

    المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-4 May, 2023

    Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

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  4. 4
    مؤتمر
    Defect Classification for Integrated Circuits Contamination on Land Grid Arrays

    المؤلفون: Khanna, Puneesh, Trejo, Vanessa Dorado, Zamora-Esquivel, Julio, Pate, Ryan

    المصدر: 2023 International Conference on Advancement in Computation & Computer Technologies (InCACCT) Advancement in Computation & Computer Technologies (InCACCT), 2023 International Conference on. :483-489 May, 2023

    Relation: 2023 International Conference on Advancement in Computation & Computer Technologies (InCACCT)

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  5. 5
    دورية أكاديمية
    Associations between gestational weight gain and weight development of the offspring: Differences depending on maternal pre-pregnancy BMI

    المؤلفون: Barzen, CharlotteAff1, IDs00404024074871_cor1, Vogel, MandyAff1, Aff2, Kiess, WielandAff1, Aff2, Poulain, TanjaAff1, Aff2

    المصدر: Archives of Gynecology and Obstetrics. 310(1):395-403

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  6. 6
    دورية أكاديمية
    Is It Diabetes or Just Macrosomia? Fetal Myocardial Performance Index in Large-for-Gestational Age Fetuses

    المؤلفون: Ayhan, IşılAff1, IDs0024602403548z_cor1, Uygur, Lütfiye

    المصدر: Pediatric Cardiology. :1-8

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  7. 7
    دورية أكاديمية
    Diabetes and pregnancy study (DAPSY): a 10-year single-center cohort study of pregnancies affected by diabetes

    المؤلفون: Kapustin, Roman, Kopteeva, EkaterinaAff1, IDs00404023071872_cor2, Tiselko, Alena, Alekseenkova, Elena, Korenevsky, Andrey, Shelaeva, Elizaveta, Arzhanova, Olga, Kogan, Igor

    المصدر: Archives of Gynecology and Obstetrics. 309(6):2643-2651

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  8. 8
    مؤتمر
    LGA-based short-term power load time series forecasting

    المؤلفون: Li, Xinmei, Wang, Jingxia, Tian, Ran

    المصدر: 2023 IEEE 2nd International Conference on Electrical Engineering, Big Data and Algorithms (EEBDA) Electrical Engineering, Big Data and Algorithms (EEBDA), 2023 IEEE 2nd International Conference on. :1695-1698 Feb, 2023

    Relation: 2023 IEEE 2nd International Conference on Electrical Engineering, Big Data and Algorithms (EEBDA)

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  9. 9
    مؤتمر
    Testing station using a 0.3-mm-pitch LGA interface for a 25-Gbaud x 16-channel CPO transceiver

    المؤلفون: Ishige, Yuta, Nagashima, Kazuya, Yoshida, Wataru, Nasu, Hideyuki

    المصدر: 2022 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2022 IEEE. :5-8 Nov, 2022

    Relation: 2022 IEEE CPMT Symposium Japan (ICSJ)

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  10. 10
    مؤتمر
    Assembly Reliability of eWLP, Die- and Die-Size BGA

    المؤلفون: Ghaffarian, Reza

    المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-9 May, 2022

    Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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