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وصف الملف: electronic resource

Relation: http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2021.001228; https://doaj.org/toc/1001-4381

URL الوصول: https://doaj.org/article/baedc65a88c4468682545f45ee92206f

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Relation: 2021 IEEE International Conference on Mechatronics and Automation (ICMA)

المؤلفون: Yu, Siyuan, Zhu, Jing, Sun, Weifeng, Lu, Yangyang, Wang, Yunqi, Zhang, Long, Zhang, Sen, Gu, Yan, He, Nailong, Zhang, Yunwu

المصدر: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2020 32nd International Symposium on. :270-273 Sep, 2020

Relation: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD)

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