المؤلفون: Ye, Jeff J., Pagadala, Raviteja, Lu, Fei

المصدر: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2024 35th Annual. :01-04 May, 2024

Relation: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

المؤلفون: Wang, Peng, Sang, Guanqiao, Lu, Yihong, Xiong, Wenjuan, Jiang, Renjie, Cao, Lei, Li, QingKun, Li, Lianlian, Yao, Jiaxin, Zhang, Yadong, Zhang, Meihe, Zhang, Qingzhu, Li, Junfeng, Yin, Huaxiang, Luo, Jun

المصدر: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) Science and Technology for Integrated Circuits (CSTIC), 2024 Conference of. :1-3 Mar, 2024

Relation: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC)

المؤلفون: Huang, Tianhao, Liu, Pan, Chen, Zeyang, Li, Sheng, Gao, Dawei, Zhou, Guodong

المصدر: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) Science and Technology for Integrated Circuits (CSTIC), 2024 Conference of. :1-3 Mar, 2024

Relation: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC)

المؤلفون: Sui, Wen, Sheplak, Mark, Feng, Philip X.-L.

المصدر: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :638-641 Jan, 2024

Relation: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Tong, Xin, Liu, Wenjuan, Wen, Zhiwei, Liu, Jieyu, Zhou, Jie, Liu, Yan, Sun, Chengliang, Cai, Yao

المصدر: 2023 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2023 IEEE International. :1-3 Sep, 2023

Relation: 2023 IEEE International Ultrasonics Symposium (IUS)

المؤلفون: Nabi, Naveed, Ahmed, Imtiaz^{Aff1, IDs40011024016090_cor2}, Wani, Gohar Bilal

المصدر: Proceedings of the National Academy of Sciences, India Section B: Biological Sciences. :1-9

المؤلفون: Ngo, Kalle, Wang, Ruize, Dubrova, Elena, Paulsrud, Nils

المصدر: 2023 IEEE 53rd International Symposium on Multiple-Valued Logic (ISMVL) ISMVL Multiple-Valued Logic (ISMVL), 2023 IEEE 53rd International Symposium on. :190-195 May, 2023

Relation: 2023 IEEE 53rd International Symposium on Multiple-Valued Logic (ISMVL)

المؤلفون: Levi, S., Tiec, R. Le, Dupre, C., Vannuffel, C., Dewolf, T., Garcia, S., Millard, K., Meynard, B., Lee, Y., Colard, M., Dujaili, H. Al, Faugier-Tovar, J., Mizuno, Shinsuke

المصدر: 2022 International Symposium on Semiconductor Manufacturing (ISSM) Semiconductor Manufacturing (ISSM), 2022 International Symposium on. :1-4 Dec, 2022

Relation: 2022 International Symposium on Semiconductor Manufacturing (ISSM)

المؤلفون: He, P., Tu, Y., Bao, T., Sousa, L., Xie, J.

المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 31(4):596-600 Apr, 2023

المؤلفون: Yang, Chi, Wu, Zhiyong, Dong, Qingshu, Li, Zili, Li, Weihua, Xiong, Shisheng

المصدر: 2022 International Workshop on Advanced Patterning Solutions (IWAPS) Advanced Patterning Solutions (IWAPS), 2022 International Workshop on. :1-4 Oct, 2022

Relation: 2022 International Workshop on Advanced Patterning Solutions (IWAPS)