يعرض 1 - 10 نتائج من 285 نتيجة بحث عن '"Lacombe, E."', وقت الاستعلام: 0.91s تنقيح النتائج
  1. 1
    مؤتمر

    المصدر: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2023 - IEEE 53rd European. :144-147 Sep, 2023

    Relation: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)

  2. 2
    مؤتمر

    المصدر: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2020 International Conference o. :145-148 Sep, 2020

    Relation: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

  3. 3
    مؤتمر

    المصدر: 2018 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) Radio Frequency Integrated Circuits Symposium (RFIC), 2018 IEEE. :356-359 Jun, 2018

    Relation: 2018 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)

  4. 4
    مؤتمر

    المصدر: 2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), 2019 44th International Conference on. :1-2 Sep, 2019

    Relation: 2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)

  5. 5
    مؤتمر

    المصدر: 2018 International Symposium on Antennas and Propagation (ISAP) Antennas and Propagation (ISAP), 2018 International Symposium on. :1-2 Oct, 2018

    Relation: 2018 International Symposium on Antennas and Propagation (ISAP)

  6. 6
    مؤتمر

    المصدر: 2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), 2018 43rd International Conference on. :1-2 Sep, 2018

    Relation: 2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz2018)

  7. 7
    دورية أكاديمية

    المصدر: IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 28(4):362-364 Apr, 2018

  8. 8
    دورية أكاديمية

    المصدر: IEEE Internet Computing IEEE Internet Comput. Internet Computing, IEEE. 8(4):32-39 Aug, 2004

  9. 9
    مؤتمر

    المؤلفون: Lacombe, E

    المساهمون: Solvay, Denbury, IFP Technologies Canada Inc., IFP Technologies Canada Inc.; Tayrona Field Services, IFP Energies Nouvelles

    المصدر: Abu Dhabi International Petroleum Exhibition & Conference.

  10. 10
    دورية أكاديمية