المؤلفون: Jouve, A., Lagoutte, E., Crochemore, R., Mauguen, G., Flahaut, T., Dubarry, C., Balan, V., Fournel, F., Bourjot, E., Servant, F., Scannell, M., Rohracher, K., Bodner, T., Faes, A., Hofrichter, J.

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :201-209 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Bourjot, E., Stewart, P., Dubarry, C., Lagoutte, E., Rolland, E., Bresson, N., Romano, G., Scevola, D., Balan, V., Dechamp, J., Zussy, M., Mauguen, G., Castan, C., Sanchez, L., Jouve, A., Fournel, F., Cheramy, S.

المصدر: 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-5 Oct, 2019

Relation: 2019 International 3D Systems Integration Conference (3DIC)

المؤلفون: Garnier, A., Lagoutte, E., Baillin, X., Gillot, C., Sillon, N.

المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1610-1615 May, 2011

Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

المؤلفون: Ferrandon, C., Greco, F., Lagoutte, E., Descours, P., Enyedy, G., Pellat, M., Gillot, C., Rey, P., Mercier, D., Cueff, M., Baillin, X., Perruchot, F., Sillon, N., Liu, L.J., Pacheco, S., Miller, M.

المصدر: 3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-6 Sep, 2010

Relation: 2010 3rd Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Pornin, J.L., Gillot, C., Parat, G., Jacquet, F., Lagoutte, E., Sillon, N., Poupon, G., Dumont, F.

المصدر: 2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :605-609 Jun, 2007

Relation: 2007 57th Electronic Components and Technology Conference

المؤلفون: Gillot, C., Lagoutte, E., Charvet, P.L., Souchon, F., Sillon, N.

المصدر: 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on. :1-4 Jun, 2005

Relation: 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis

المؤلفون: Lodillinsky, C^{Aff1, IDonc201587_cor1}, Infante, E, Guichard, A, Chaligné, R, Fuhrmann, L, Cyrta, J, Irondelle, M, Lagoutte, E, Vacher, S, Bonsang-Kitzis, H, Glukhova, M, Reyal, F, Bièche, I, Vincent-Salomon, A^{Aff2, Aff6}, Chavrier, P^{Aff1, IDonc201587_cor15}

المصدر: Oncogene. 35(3):344-357

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المؤلفون: Imbert, B., Blot, X., Tauzin, A., Salvetat, T., Lagoutte, E., Lecouvey, C., Chaira, T., Larrey, V., Bridoux, C., Fournel, F., Delaye, V., Papon, A.-M., Moriceau, H., Carron, V.

المصدر: Microsystem Technologies: Micro- and NanosystemsInformation Storage and Processing Systems. May 2015 21(5):973-977

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