المؤلفون: Lai, C. M., Hung, J. L., Chen, C. C.

المصدر: 2019 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) Industrial Engineering and Engineering Management (IEEM), 2019 IEEE International Conference on. :1431-1435 Dec, 2019

Relation: 2019 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)

المؤلفون: Chen, C. C., Hung, J. L., Lai, C. M.

المصدر: 2019 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) Industrial Engineering and Engineering Management (IEEM), 2019 IEEE International Conference on. :1413-1416 Dec, 2019

Relation: 2019 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)

المؤلفون: Hua, Xuan, Xu, Hong, Zhang, Li, Chen, Dong, Tan, K H, Lai, C M, Lau, John, Li, Ming, Li, Margie, Kuah, Eric, Fan, Nelson, Kai, Wu, Cheung, Ken

المصدر: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-6 Dec, 2017

Relation: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Ning, Wenguo, Zhao, Qiang, Zheng, Kai, Chen, Dong, Guo, Hongyan, Zhang, Li, Hu, Zhengxun, Tan, K. H., Lai, C. M.

المصدر: 2014 15th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2014 15th International Conference on. :313-316 May, 2014

Relation: 2014 15th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Tsai, J.-H., Wang, H.-H., Yen, Y.-C., Lai, C.-M., Chen, Y.-J., Huang, P.-C., Hsieh, P.-H., Chen, H., Lee, C.-C.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 50(6):1382-1398 Jun, 2015

المؤلفون: Xie, Ye, Chen, Dong, Zhang, Li, Tan, K H, Lai, C M

المصدر: 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :1170-1174 Aug, 2013

Relation: 2013 14th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Chen, Dong, Lai, C. M., Tan, K. H., Zhang, Li, Long, Xinjiang

المصدر: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. :1-4 Aug, 2011

Relation: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

المؤلفون: Xinhai, Bian, Hongyan, Guo, Li, Zhang, Tan, K H, Lai, C M

المصدر: 2014 15th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2014 15th International Conference on. :36-38 May, 2014

Relation: 2014 15th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Lai, C.-M., Tan, K.-W., Chen, Y.-J., Chu, T.-S.

المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 61(7):2074-2087 Jul, 2014

المؤلفون: Yeh, W.-K., Lai, C.-M., Lin, C.-T., Fang, Y.-K., Hu, H.-H., Chen, K.-M., Huang, G.-W.

المصدر: 2005 IEEE Conference on Electron Devices and Solid-State Circuits Electron Devices and Solid-State Circuits, 2005 IEEE Conference on. :91-94 2005

Relation: 2005 IEEE Conference on Electron Devices and Solid-State Circuits