المؤلفون: Rideau, D., Uhring, W., Bianchi, R. A., Helleboid, R., Mugny, G., Grebot, J., Manouvrier, J.R., Neri, R., Brun, F., Lakeh, M. Dolatpoor, Rink, S., Kammerer, J-B., Lallement, C., Lacombe, E., Golanski, D., Rae, B., Bah, T. M., Twaddle, F., Quenette, V., Marchand, G., Buj, C., Fillon, R., Henrion, Y., Nicholson, I., Agnew, M., Basset, M., Perrier, R., Al-Rawhani, M., Mamdy, B., Pellegrin, S., Gouget, G., Maciazek, P., Juge, A., Dartigues, A., Alause, H. Wehbe

المصدر: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2023 - IEEE 53rd European. :144-147 Sep, 2023

Relation: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)