المؤلفون: Horibe, Akihiro, Watanabe, Takahito, Marushima, Chinami, Kohara, Sayuri, Yamada, Yasuharu, Mori, Hiroyuki, Taneja, Divya, Pilger, Katherine, Jacques-Fortin, Alexis, Godard, Maxime, Chen, Qianwen, Perfecto, Eric, Jain, Aakrati, Ross, Joseph R, Wassick, Thomas, De Sousa, Isabel

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :269-273 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Arbeláez Toro, Juan José

المساهمون: University/Department: Universitat de Girona. Departament d'Enginyeria Mecànica i de la Construcció Industrial

مرشدي الرسالة: Trias Mansilla, Daniel, Blanco Villaverde, Norbert, Mayugo Majó, Joan Andreu

المصدر: TDX (Tesis Doctorals en Xarxa)

مصطلحات موضوعية: Actualització del model d'elements finits, Actualización del modelo de elementos finitos, Finite element model updating, FEMU, Correlació digital d'imatges, Correlación digital de imágenes, Digital image correlation, DIC, Identificació elàstica, Identificación elástica, Elastic identification, Mètode invers, Método inverso, Inverse method, Fabricació additiva, Fabricación aditiva, Additive manufacturing, Impressió 3D, Impresión 3D, 3D printing, Compostos de fibra continua de carboni i matriu termoplàstica, Compuestos de fibra continua de carbono y matriz termoplástica, Composites of continuous carbon fiber and thermoplastic matrix, Laminats simètrics i balancejats, Laminados simétricos y balanceados, Symmetrical and balanced laminates

وصف الملف: application/pdf

URL الوصول: http://hdl.handle.net/10803/688859

المؤلفون: Ke, X., Chai, J., Shao, X., Duan, J., Sun, X., Yang, S., Xiang, J., Han, K., Wang, Y., Xu, H., Wang, X., Zhang, J., Wang, W.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(6):3651-3658 Jun, 2024

المؤلفون: Maus, I., Niessner, M., Zhang, M., Hartner, W., Seiler, B., Altieri-Weimar, P.

المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المصدر: Flexible Electronic Packaging and Encapsulation Technology. May 10, 2024

المؤلفون: Chen, S.Y., Peng, T., Han, X.T., Cao, Q.L., Xiao, H.X., Li, W.Z., Li, L.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 34(5):1-5 Aug, 2024

المؤلفون: Kang, Byoung-Phil, Lee, Ken, Kim, Jaesung, Lee, Jong-Yun

المصدر: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024

Relation: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

المؤلفون: Lee, H.J., Nam, S., Lee, Y., Kim, K., Choe, D., Yoo, S., Park, Y., Jo, S., Kim, D., Heo, J.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(4):2411-2416 Apr, 2024

المؤلفون: Karami, F., Boutayeb, H., Talbi, L., Hettak, K., Ghayekhloo, A.

المصدر: IEEE Transactions on Vehicular Technology IEEE Trans. Veh. Technol. Vehicular Technology, IEEE Transactions on. 73(3):3457-3468 Mar, 2024

المؤلفون: Liu, H., Tinsley, L., Deng, K., Wang, Y., Starr, A., Chen, Z., Zhao, Y.

المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 71(3):3163-3172 Mar, 2024