المؤلفون: Johannes Drechsel, Henry Barth, Lars Rebenklau

المصدر: Power Electronic Devices and Components, Vol 8, Iss , Pp 100060- (2024)

مصطلحات موضوعية: Power electronics, Ceramics, Partial discharge measurement, Non-destructive characterization, High voltage, Electric apparatus and materials. Electric circuits. Electric networks, TK452-454.4

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2772370424000051; https://doaj.org/toc/2772-3704

URL الوصول: https://doaj.org/article/ba8ce60f03e34ac88f285570c9265b7b

المؤلفون: Mis, E., Borucki, M., Dziedzic, A., Slawomir Kaminski, Lars Rebenklau, Wolter, K.-J., Sonntag, F.

المصدر: 2006 1st Electronic Systemintegration Technology Conference Electronics Systemintegration Technology Conference, 2006. 1st. 2:954-960 Sep, 2006

Relation: 2006 1st Electronic Systemintegration Technology Conference

المؤلفون: Justin Ziener, Henry Barth, Philipp Horn, Uwe Scheithauer, Lars Rebenklau, Steven Weingarten, Lutz Gollmer

المساهمون: Publica

المصدر: Keramische Zeitschrift. 73:38-43

مصطلحات موضوعية: Marketing, chemistry.chemical_classification, Thermoplastic, Materials science, Visual Arts and Performing Arts, Natural materials, direktes AM-Verfahren, Mechanical engineering, CerAM MMJ, Multimaterialbauteil, chemistry, Phase (matter), visual_art, Ceramics and Composites, visual_art.visual_art_medium, multi-material jetting, Ceramic, additive Fertigung

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7e07dae4be5662c457058b7c995cbcd5
https://doi.org/10.1007/s42410-021-0523-y

المؤلفون: Johannes Drechsel, Henry Barth, Lars Rebenklau

المصدر: 2022 45th International Spring Seminar on Electronics Technology (ISSE).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::13a536d17baa0800c0977034d2433fd1
https://doi.org/10.1109/isse54558.2022.9812784

المؤلفون: Michael Schneider, Lars Rebenklau, Lenka Simunkova, Paul Gierth, Uta Gierth

المساهمون: Publica

المصدر: Materials and Corrosion. 71:1832-1841

مصطلحات موضوعية: EIS, Materials science, Mechanical Engineering, Metals and Alloys, Electronic packaging, electronic packaging, General Medicine, Surfaces, Coatings and Films, FTIR, Chemical engineering, Mechanics of Materials, Materials Chemistry, Environmental Chemistry, Degradation (geology), Adhesive, adhesives, Fourier transform infrared spectroscopy, degradation

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::44cba5d734f7412a03bb8f4ee416c11c
https://doi.org/10.1002/maco.202011772

المؤلفون: Henry Barth, Lars Rebenklau, Uwe Scheithauer, Nick Alsdorf, Eric Schwarzer-Fischer

المصدر: Proceedings of the 17th Rapid.Tech 3D Conference Erfurt, Germany, 22–23 June 2021

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bfc023822e570086da5a2e9580649b9e
https://doi.org/10.3139/9783446471733.023

المؤلفون: Johannes Drechsel, Henry Barth, Lars Rebenklau

المصدر: 2021 44th International Spring Seminar on Electronics Technology (ISSE).

مصطلحات موضوعية: Materials science, System of measurement, Mechanical engineering, High voltage, Switchgear, law.invention, law, visual_art, Power electronics, Partial discharge, visual_art.visual_art_medium, Transient (oscillation), Ceramic, Transformer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::45fbcd988f98d4f0fd7e2bc6b9dab358
https://doi.org/10.1109/isse51996.2021.9467556

المؤلفون: Klaus Augsburg, Lars Rebenklau, Eric Bachmann, Lars Niedermeyer, Paul Gierth

المساهمون: Publica

المصدر: Journal of Sensors and Sensor Systems, Vol 7, Pp 43-49 (2018)

مصطلحات موضوعية: business.industry, Computer science, lcsh:T, 020209 energy, Automotive industry, Mechanical engineering, 02 engineering and technology, 3D printing, lcsh:Technology, sensor networks, Thermocouple, Combustion process, Component (UML), 0202 electrical engineering, electronic engineering, information engineering, Thermal protection, Electrical and Electronic Engineering, business, Instrumentation, thick film thermocouple

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::784f6be8b07aee913d03f82d30b04a45
https://www.j-sens-sens-syst.net/7/43/2018/

المؤلفون: Lars Rebenklau, Paul Gierth

المصدر: 2018 7th Electronic System-Integration Technology Conference (ESTC).

مصطلحات موضوعية: Microelectromechanical systems, Interconnection, Materials science, Thermocouple, law, Surface acoustic wave sensor, Thermal stability, Welding, Composite material, Electric resistance welding, Characterization (materials science), law.invention

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2f4821a57ab992ad8c22637cd0f58995
https://doi.org/10.1109/estc.2018.8546509

المؤلفون: H. Grießmann, P. Gierth, Lars Rebenklau

المصدر: Scopus-Elsevier

مصطلحات موضوعية: Materials science, business.industry, Characterization (materials science), Low noise, Conductor, Soldering, visual_art, visual_art.visual_art_medium, Electronic engineering, Thick film technology, Optoelectronics, Breakdown voltage, Pharmacology (medical), Ceramic, business, Electrical conductor

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7969bfe6b91d9fec78523f51f63c1d97
https://doi.org/10.4071/cicmt-tp23