المؤلفون: Fettke, Matthias, Fisch, Anne, Geschke, Tom, Frick, Alexander, Alyasin, Khaled, Teutsch, Thorsten

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1298-1305 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Janisch, L., Ockel, M., Schlichting, J., Breuer, M., Franke, J.

المصدر: 2023 11th International Conference on Control, Mechatronics and Automation (ICCMA) Control, Mechatronics and Automation (ICCMA), 2023 11th International Conference on. :259-264 Nov, 2023

Relation: 2023 11th International Conference on Control, Mechatronics and Automation (ICCMA)

المؤلفون: Fang, Z., Zhang, J., Gao, L., Chen, H., Yang, X., Liu, J., Li, W., Cai, X.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(11):1817-1824 Nov, 2023

المؤلفون: Pavlicek, Niko, Mohn, Fabian

المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-4 Sep, 2020

Relation: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

المؤلفون: Fettke, Matthias, Kubsch, Timo, Kolbasow, Andrej, Bejugam, Vinith, Frick, Alexander, Teutsch, Thorsten

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1016-1024 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Kolbasow, Andrej, Fettke, Matthias, Kubsch, Timo, Bejugam, Vinith, Teutsch, Thorsten

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1936-1942 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Fang, Zhen^{Aff1, Aff2}, Zhang, Jihua^{Aff1, Aff2, Aff3, IDFITEE2200573_cor2}, Gao, Libin^{Aff1, Aff2}, Chen, Hongwei^{Aff1, Aff2}, Li, Wenlei^{Aff1, Aff2}, Liang, Tianpeng^{Aff1, Aff2}, Cai, Xudong^{Aff1, Aff2}, Cai, Xingzhou, Jia, Weicong, Guo, Huan, Li, Yong

المصدر: Frontiers of Information Technology & Electronic Engineering. 24(6):916-926

المؤلفون: Fu, Xianliang, Li, Yi, Li, Xifeng, Tian, Rui, Yin, Luqiao, Zhang, Jianhua

المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :1084-1088 Aug, 2018

Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Tian, Rui, Li, Yi, Yin, Luqiao, Zhang, Jianhua

المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :844-849 Aug, 2017

Relation: 2017 18th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Li, Yi, Xiao, Yanyi, Wang, Wen, Yin, Luqiao, Zhang, Jianhua

المصدر: 2016 17th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. :1146-1150 Aug, 2016

Relation: 2016 17th International Conference on Electronic Packaging Technology (ICEPT)