المؤلفون: Lau, J.H.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(3):376-396 Mar, 2024

المؤلفون: Lau, J.H., Lin, C., Liu, H., Yang, K., Xia, T., Ko, C., Lin, B.P., Chuang, Y., Chen, R., Ma, M., Tseng, T., Li, M., Leung, K.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(9):1371-1379 Sep, 2023

المؤلفون: Lau, J.H.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(3):399-425 Mar, 2023

المؤلفون: Lau, J.H.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(1):3-25 Jan, 2023

المؤلفون: Shu, C., Zhang, Z., Chen, Y., Xiao, J., Lau, J.H., Zhang, Q., Lu, Z.

المصدر: IEEE Access Access, IEEE. 11:99365-99375 2023

المؤلفون: Lau, J.H.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(8):1271-1281 Aug, 2022

المؤلفون: Peng, T.C., Lau, J.H., Ko, C., Lee, P., Lin, E., Yang, K., Lin, B.P., Xia, T., Chang, L., Liu, H., Lin, C., Lee, T.N., Wong, J., Ma, M., Tseng, T.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(3):469-478 Mar, 2022

المؤلفون: Lau, J.H.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(2):228-252 Feb, 2022

المؤلفون: Lau, J.H., Chen, G.C., Huang, J.Y., Chou, R.T., Yang, C.C., Liu, H., Tseng, T.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(8):1301-1309 Aug, 2021

المؤلفون: Lau, J.H., Ko, C., Lin, C., Tseng, T., Yang, K., Xia, T., Lin, P.B., Peng, C., Lin, E., Chang, L., Liu, N., Chiu, S.M., Lee, T.N.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(5):739-747 May, 2021