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1دورية أكاديمية
المؤلفون: Lau, J.H.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(3):376-396 Mar, 2024
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2دورية أكاديمية
المؤلفون: Lau, J.H., Lin, C., Liu, H., Yang, K., Xia, T., Ko, C., Lin, B.P., Chuang, Y., Chen, R., Ma, M., Tseng, T., Li, M., Leung, K.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(9):1371-1379 Sep, 2023
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3دورية أكاديمية
المؤلفون: Lau, J.H.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(3):399-425 Mar, 2023
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4دورية أكاديمية
المؤلفون: Lau, J.H.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(1):3-25 Jan, 2023
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5دورية أكاديمية
المصدر: IEEE Access Access, IEEE. 11:99365-99375 2023
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6دورية أكاديمية
المؤلفون: Lau, J.H.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(8):1271-1281 Aug, 2022
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7دورية أكاديمية
المؤلفون: Peng, T.C., Lau, J.H., Ko, C., Lee, P., Lin, E., Yang, K., Lin, B.P., Xia, T., Chang, L., Liu, H., Lin, C., Lee, T.N., Wong, J., Ma, M., Tseng, T.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(3):469-478 Mar, 2022
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8دورية أكاديمية
المؤلفون: Lau, J.H.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(2):228-252 Feb, 2022
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9دورية أكاديمية
المؤلفون: Lau, J.H., Chen, G.C., Huang, J.Y., Chou, R.T., Yang, C.C., Liu, H., Tseng, T.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(8):1301-1309 Aug, 2021
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10مؤتمر
المؤلفون: Lau, J.H., Ko, C.-T., Yang, K.-M., Peng, C.-Y., Xia, T., Lin, P.B., Chen, J.J., Huang, P.-C., Liu, H.N., Tseng, T.-J.
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :339-347 Jun, 2020
Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)