يعرض 1 - 10 نتائج من 1,428 نتيجة بحث عن '"Law, T"', وقت الاستعلام: 1.09s تنقيح النتائج
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    دورية أكاديمية

    المؤلفون: Liu, Y., Lee, T., Law, T., Lee, K.Y.

    المصدر: IEEE/ACM Transactions on Audio, Speech, and Language Processing IEEE/ACM Trans. Audio Speech Lang. Process. Audio, Speech, and Language Processing, IEEE/ACM Transactions on. 27(6):1047-1059 Jun, 2019

  3. 3
    مؤتمر

    المصدر: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :718-723 Nov, 2016

    Relation: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

  4. 4
    مؤتمر

    المصدر: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-7 Dec, 2015

    Relation: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

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    مؤتمر

    المؤلفون: Law, T. M., Chan, S. C.

    المصدر: 2006 14th European Signal Processing Conference Signal Processing Conference, 2006 14th European. :1-5 Sep, 2006

    Relation: 2006 14th European Signal Processing Conference

  7. 7
    مؤتمر

    المصدر: 2005 3rd IEEE/EMBS Special Topic Conference on Microtechnology in Medicine and Biology Microtechnology in medicine and biology Microtechnology in Medicine and Biology, 2005. 3rd IEEE/EMBS Special Topic Conference on. :408-411 2005

    Relation: 2005 3rd IEEE/EMBS Special Topic Conference on Microtechnology in Medicine and Biology

  8. 8
    مؤتمر

    المصدر: Proceedings. International Conference on Power System Technology Power systems technology Power System Technology, 2002. Proceedings. PowerCon 2002. International Conference on. 3:1758-1762 vol.3 2002

    Relation: PowerCon 2002

  9. 9
    دورية أكاديمية

    المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 30(2):264-268 Jun, 2007

  10. 10
    دورية أكاديمية

    المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 30(2):269-274 Jun, 2007