المؤلفون: Le Goff, T.^{Aff1, IDs11664022098547_cor1}, Pichon, T., Baier, N., Gravrand, O., Boulade, O.

المصدر: Journal of Electronic Materials. 51(10):5586-5593

المؤلفون: Belguechi, R., Le-goff, T., Cherrier, E., Rosenberger, C.

المصدر: 2011 Conference on Network and Information Systems Security Network and Information Systems Security (SAR-SSI), 2011 Conference on. :1-7 May, 2011

Relation: 2011 Conference on Network and Information Systems Security (SAR-SSI)

المؤلفون: Holland, Andrew D., Minoglou, Kyriaki, Le Goff, T., Gravrand, O., Lobre, C., Boulade, O., Ketchazo, C., Pichon, T.

المصدر: Proceedings of SPIE; August 2024, Vol. 13103 Issue: 1 p131030Z-131030Z-10, 12971981p

المؤلفون: Fulop, Gabor F., MacDougal, Michael H., Ting, David Z., Kimata, Masafumi, Le Goff, T., Ketchazo, C., Lobre, C., Boulade, O., Pichon, T., Gravrand, O., Horeau, B., Badano, G.

المصدر: Proceedings of SPIE; June 2024, Vol. 13046 Issue: 1 p130460W-130460W-10, 12915551p

المؤلفون: Simonetto, E., Charlet, C., Labergerie, E., Batifol, G., Guivarch, T., Le Goff, T., Senra, C.

المصدر: International Archives of the Photogrammetry, Remote Sensing & Spatial Information Sciences; 2023, Vol. 48 Issue M/2, p1473-1478, 6p

مصطلحات موضوعية: PHOTOGRAMMETRY, POINT cloud, WRITING processes, HISTORIC buildings, CAMERAS

المؤلفون: Fulop, Gabor F., Ting, David Z., Zheng, Lucy L., Le Goff, T., Rochette, F., Gravrand, O., Baier, N., Lobre, C., Kerlain, A.

المصدر: Proceedings of SPIE; June 2023, Vol. 12534 Issue: 1 p125340Q-125340Q-7, 1128068p

المؤلفون: Charsley, E.L., Laye, P.G., Markham, H.M., Le Goff, T.

المصدر: In Thermochimica Acta 2010 497(1):72-76

المؤلفون: Le Goff, T. J. A., Sutherland, D. M. G.

المصدر: Past & Present, 1974 Feb 01(62), 96-119.

URL الوصول: https://www.jstor.org/stable/650464

المؤلفون: Le Goff, T. J. A., Sutherland, D. M. G.

المصدر: Past & Present, 1983 May 01(99), 65-87.

URL الوصول: https://www.jstor.org/stable/650585

المؤلفون: Le Goff, T., Joseph, B., Wood, S.

المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. May 2009 96(2):653-662