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1مؤتمر
المؤلفون: Kao, Jung-Chun, Ma, Guang-Han, Lee, Cheng-Yu, Kuo, Chun-Fu, Hong, Jia-Hong
المصدر: 2024 IEEE Wireless Communications and Networking Conference (WCNC) Wireless Communications and Networking Conference (WCNC), 2024 IEEE. :01-06 Apr, 2024
Relation: 2024 IEEE Wireless Communications and Networking Conference (WCNC)
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2مؤتمر
المؤلفون: Liu, Yu-Jen, Chen, Shin-Kuan, Lee, Cheng-Yu, Kuo, Yu-Wei
المصدر: 2024 10th International Conference on Applied System Innovation (ICASI) Applied System Innovation (ICASI), 2024 10th International Conference on. :1-3 Apr, 2024
Relation: 2024 10th International Conference on Applied System Innovation (ICASI)
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3مؤتمر
المؤلفون: Liu, Yu-Jen, Lee, Cheng-Yu, Liu, Wei-Ming, Lee, Yih-Der, Cheng, Chin-Chan, Chen, Yen-Fu
المصدر: 2022 8th International Conference on Applied System Innovation (ICASI) Applied System Innovation (ICASI), 2022 8th International Conference on. :33-36 Apr, 2022
Relation: 2022 8th International Conference on Applied System Innovation (ICASI)
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4مؤتمر
المؤلفون: Liu, Yu-Jen, Lee, Cheng-Yu, Hou, Po-Yu, Sun, Pei-Hao
المصدر: 2022 8th International Conference on Applied System Innovation (ICASI) Applied System Innovation (ICASI), 2022 8th International Conference on. :37-40 Apr, 2022
Relation: 2022 8th International Conference on Applied System Innovation (ICASI)
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5مؤتمر
المؤلفون: Liu, Yu-Jen, Lee, Yih-Der, Lee, Cheng-Yu, Cheng, Chin-Chan, Hou, Po-Yu, Chen, Yen-Fu
المصدر: 2022 IET International Conference on Engineering Technologies and Applications (IET-ICETA) Engineering Technologies and Applications (IET-ICETA), 2022 IET International Conference on. :1-2 Oct, 2022
Relation: 2022 IET International Conference on Engineering Technologies and Applications (IET-ICETA)
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6دورية أكاديمية
المؤلفون: Chang, Yu-Hsun, Lin, Yu-Ming, Lee, Cheng-Yu, Hsu, Pei-Chia, Chen, Chih-Ming, Ho, Cheng-En
المصدر: In Journal of Materials Research and Technology July-August 2024 31:1008-1016
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7مؤتمر
المؤلفون: Lee, Pei-Tzu, Hsieh, Wan-Zhen, Lee, Cheng-Yu, Kao, C. R., Ho, Cheng-En
المصدر: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :113-114 May, 2021
Relation: 2021 International Conference on Electronics Packaging (ICEP)
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8دورية أكاديمية
المؤلفون: Nguyen, Phuong-Dung Thi, Lee, Cheng-Yu
المصدر: Management Decision, 2023, Vol. 61, Issue 5, pp. 1374-1394.
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9دورية أكاديميةHigh-frequency signal transmission in a coplanar waveguide structure with different surface finishes
المؤلفون: Chiang, Ying-Chih, Tseng, Hao-Wei, Yu, Chun-Jou, Lee, Cheng-Yu, Huang, Chien-Chang, Ho, Cheng-En
المصدر: In Thin Solid Films 1 November 2023 784
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10دورية أكاديمية
المؤلفون: Chu, Hongwei, Hu, Xiaokang, Lee, Cheng-Yu, Zhang, Anning, Ye, Yang, Wang, Yuxin, Chen, Yangyang, Yan, Xiao, Wang, Xinzhong, Wei, Jun, He, Sisi, Li, Yingchun
المصدر: In Biosensors and Bioelectronics 15 July 2023 232