يعرض 1 - 10 نتائج من 306 نتيجة بحث عن '"Lee, Choong jae"', وقت الاستعلام: 0.95s تنقيح النتائج
  1. 1
    مؤتمر
    Evaluation of bonding characteristics of thermal compression bonded solder joints via nanoindentation test

    المؤلفون: You, Hungsuk, Min, Kyung Deuk, Lee, Choong-Jae, Jang, Jun-Ho, Kang, Dong-Gil, Jung, Seung-Boo

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2178-2183 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Microstructural evolution and mechanical properties of SAC305 with the intense pulsed light soldering process under high-temperature storage test

    المؤلفون: Jang, Jun-Ho, Lee, Choong-Jae, Hwang, Byeong-Uk, Min, Kyung Deuk, Kim, Jae-Ha, Jung, Seung-Boo

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2314-2319 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Pressureless transient liquid phase sintering bonding using SAC305 with hybrid Ag particles for high–temperature packaging applications

    المؤلفون: Hwang, Byeong-Uk, Min, Kyung Deuk, Jung, Kwang-Ho, Lee, Choong-Jae, Kim, Jae-Ha, Jung, Seung-Boo

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1855-1860 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Growth kinetics of intermetallic compound layers at the interface during laser-assisted bonding depending on surface finish

    المؤلفون: Joo, Hong-Sub, Min, Kyung Deuk, Lee, Choong-Jae, Hwang, Byeong Uk, Jung, Seung-Boo

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1916-1921 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Thermomechanical Properties of Fan-Out Wafer Level Package Fabricated with Various Epoxy Mold Compound

    المؤلفون: Jeong, Haksan, Jung, Kwang-Ho, Lee, Choong-Jae, Min, Kyung Deuk, Jung, Seung-Boo

    المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-5 Sep, 2019

    Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

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  6. 6
    مؤتمر
    Pressureless Transient Liquid Phase Sintering Bonding of Sn-58Bi with Ni Particles for High-Temperature Packaging Applications

    المؤلفون: Min, Kyung Deuk, Jung, Kwang-Ho, Lee, Choong-Jae, Jung, Seung-Boo

    المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2290-2295 May, 2019

    Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Thermal Characteristic of Sn-MWCNT Nanocomposite Solder in LED Package

    المؤلفون: Lee, Choong-Jae, Moon, Jae Jung, Jung, Kwang-Ho, Jung, Seung-Boo

    المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :2225-2230 May, 2017

    Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    14nm FinFET process technology platform for over 100M pixel density and ultra low power 3D Stack CMOS Image Sensor

    المؤلفون: Yu, Donghee, Lee, Choong jae, Park, Myounkyu, Park, Junghwan, Hwang, Seungju, Lee, Joonhyung, Yu, Sunghun, Shin, Hyunjung, Kim, ByoungHo, Choi, Jong-Won, Jung, Sangil, Kwon, Minho, Ha, Il-Seon, Kim, Chaesung, Cho, Sanghyun, Lim, Seunghyun, Kim, Won-Woong, Kim, Moo-Young, Park, Seonghye, Lee, Ki-Don, Ranjan, Rakesh, Maeda, Shigenobu, Jeong, Gitae

    المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :8.1.1-8.1.4 Dec, 2019

    Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

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  9. 9
    دورية أكاديمية
    Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test

    المؤلفون: Jang, Jun-Ho, Min, Kyung Deuk, Lee, Choong-Jae, Hwang, Byeong-Uk, Jung, Seung-BooAff1

    المصدر: Journal of Electronic Materials. 50(10):5639-5646

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  10. 10
    دورية أكاديمية

    لا يتم عرض هذه النتيجة على الضيوف.

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