المؤلفون: Lee, H.P., Rehm, P., Makdad, M., Miller, E., Lu, N.

المصدر: IEEE Transactions on Power Delivery IEEE Trans. Power Delivery Power Delivery, IEEE Transactions on. 39(4):2327-2339 Aug, 2024

المؤلفون: Hu, Y., Li, Y., Song, L., Lee, H.P., Rehm, P.J., Makdad, M., Miller, E., Lu, N.

المصدر: IEEE Transactions on Smart Grid IEEE Trans. Smart Grid Smart Grid, IEEE Transactions on. 15(2):2309-2320 Mar, 2024

المؤلفون: Sepulveda-Ramos, N.E., Teng, J.W., Ildefonso, A., Lee, H.P., Rao, S.G., Cressler, J.D.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(3):850-856 Mar, 2023

المؤلفون: Liu, C., Chen, L., Lee, H.P., Yang, Y., Zhang, X.

المصدر: IEEE Transactions on Vehicular Technology IEEE Trans. Veh. Technol. Vehicular Technology, IEEE Transactions on. 72(2):1689-1700 Feb, 2023

المؤلفون: Lee, H.P., Dsouza, K., Chen, K., Lu, N., Baran, M.E.

المصدر: IEEE Access Access, IEEE. 11:101514-101524 2023

المؤلفون: Lu, C.A., Lee, H.P., Chen, H.C., Lin, Y.C., Chung, Y.H., Wang, S.H., Yeh, J.Y., Chang, V.S., Chiang, M.C., Chang, W., Chung, H.C., Cheng, C.F., Hsu, H.H., Liu, H.H., Chen, William P.N., Lin, C.Y.

المصدر: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023

Relation: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

المؤلفون: Leong, K.H., Zhi, J., Tan, V.B.C, Lee, H.P., Tay, T.E.

المصدر: In Composites Part A March 2024 178

المؤلفون: Cao, J., Liang, W., Wang, Y., Lee, H.P., Zhu, J., Ren, Q.

المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 67(5):3809-3818 May, 2020

المؤلفون: Leong, K.H., Zhi, J., Lee, H.P., Tan, V.B.C., Tay, T.E.

المصدر: In Composite Structures 1 February 2023 305

المؤلفون: Leong, K.H., Zhi, J., Lee, H.P., Tan, V.B.C., Tay, T.E.

المصدر: In Composites Part A March 2022 154