المؤلفون: Yeh, Shu-Shen, Lin, P. Y., Lee, K. C., Yew, M. C., Yang, C. C., Wang, J. H., Hsu, C. K., Lai, P. C., Tseng, Dion, Cheng, S. K., Jeng, Shin-Puu

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1081-1086 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Yeh, Shu-Shen, Lin, P. Y., Yew, M. C., Lin, W. Y., Lee, K. C., Yang, C. C., Wang, J. H., Lai, P. C., Hsu, C. K., Jeng, Shin-Puu

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1550-1555 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: Lee, D. S.^Aff9, Lee, K. C.^Aff9, Kim, H. J.^Aff9, Kim, S.^Aff9

المساهمون: Goos, Gerhard, Founding Editor^Aff1, Hartmanis, Juris, Founding Editor^Aff2, Bertino, Elisa, Editorial Board Member^Aff3, Gao, Wen, Editorial Board Member^Aff4, Steffen, Bernhard, Editorial Board Member^Aff5, Yung, Moti, Editorial Board Member^Aff6, Chen, Jessie Y. C., editor^Aff7, Fragomeni, Gino, editor^Aff8

المصدر: Virtual, Augmented and Mixed Reality : 15th International Conference, VAMR 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23–28, 2023, Proceedings. 14027:253-265

المؤلفون: Wong, Patrick, Lo, W K, Fung, Richard, Lee, K C

المصدر: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), 2018 IEEE International Symposium on. :41-44 May, 2018

Relation: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)

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المؤلفون: Chen, Y.-L., Lee, G.-Y., Tang, D.-W., Huang, K., Lo, P.-Y., Huang, J.-H., Cho, E.-C., Lee, K.-C.

المصدر: In Materials Today Chemistry January 2023 27

المؤلفون: Han, H., Park, S. J., Sung, C., Kang, J., Lee, Y. H.^{Aff1, Aff2}, Chung, J., Hahm, T. S., Kim, B., Park, J.-K., Bak, J. G., Cha, M. S., Choi, G. J., Choi, M. J., Gwak, J., Hahn, S. H., Jang, J., Lee, K. C., Kim, J. H., Kim, S. K.^{Aff4, Aff5}, Kim, W. C., Ko, J.^{Aff1, Aff6}, Ko, W. H.^{Aff1, Aff6}, Lee, C. Y., Lee, J. H.^{Aff1, Aff6}, Lee, J. H., Lee, J. K.^{Aff1, Aff6}, Lee, J. P., Lee, K. D., Park, Y. S., Seo, J., Yang, S. M., Yoon, S. W., Na, Y.-S.^{Aff2, IDs41586022050081_cor33}

المصدر: Nature: International weekly journal of science. 609(7926):269-275

المؤلفون: Rozen, J., Ogawa, Y., Ando, T., Bao, R., Cartier, E., Honda, K., Lee, K.-C., Bruley, J., Miyazoe, H., Suu, K., Hatanaka, M., Narayanan, V.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :36.4.1-36.4.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

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