يعرض 1 - 10 نتائج من 3,678 نتيجة بحث عن '"Lee, K. M."', وقت الاستعلام: 1.21s تنقيح النتائج
  1. 1
    مؤتمر

    المؤلفون: Sanei, Saeid, Tracey Lee, K. M.

    المصدر: 2018 IEEE 23rd International Conference on Digital Signal Processing (DSP) Digital Signal Processing (DSP), 2018 IEEE 23rd International Conference on. :1-5 Nov, 2018

    Relation: 2018 IEEE 23rd International Conference on Digital Signal Processing (DSP)

  2. 2
  3. 3
    مؤتمر

    المصدر: 2019 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2019 IEEE International. :1-3 Mar, 2019

    Relation: 2019 IEEE International Reliability Physics Symposium (IRPS)

  4. 4
    مؤتمر

    المؤلفون: Choi, S. H., Lee, K. M.

    المصدر: 2018 Progress in Electromagnetics Research Symposium (PIERS-Toyama) Electromagnetics Research Symposium (PIERS-Toyama), 2018 Progress in. :2299-2301 Aug, 2018

    Relation: 2018 Progress in Electromagnetics Research Symposium (PIERS-Toyama)

  5. 5
    دورية أكاديمية
  6. 6
    دورية أكاديمية
  7. 7
    مؤتمر

    المصدر: 2018 6th International Conference on Brain-Computer Interface (BCI) Brain-Computer Interface (BCI), 2018 6th International Conference on. :1-3 Jan, 2018

    Relation: 2018 6th International Conference on Brain and Computer Interface (BCI)

  8. 8
    مؤتمر

    المصدر: 2016 IEEE International Conference on Industrial Technology (ICIT) Industrial Technology (ICIT), 2016 IEEE International Conference on. :90-95 Mar, 2016

    Relation: 2016 IEEE International Conference on Industrial Technology (ICIT)

  9. 9
    مؤتمر

    المؤلفون: Yi, C., Lee, K. M., Kim, M.

    المصدر: 2016 Progress in Electromagnetic Research Symposium (PIERS) Progress in Electromagnetic Research Symposium (PIERS). :4670-4672 Aug, 2016

    Relation: 2016 Progress in Electromagnetic Research Symposium (PIERS)

  10. 10
    دورية أكاديمية

    المؤلفون: Lee, K.-M., Teng, W.-G., Hou, T.-W.

    المصدر: IEEE Transactions on Automation Science and Engineering IEEE Trans. Automat. Sci. Eng. Automation Science and Engineering, IEEE Transactions on. 13(3):1308-1317 Jul, 2016