يعرض 1 - 3 نتائج من 3 نتيجة بحث عن '"Lee, SangHyoun"', وقت الاستعلام: 1.03s تنقيح النتائج
  1. 1
    مؤتمر
    Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era

    المؤلفون: Choi, MiKyeong, Jung, HyunHye, Oh, KwangSeok, Ryu, DongSu, Lee, SangHyoun, Do, WonChul, Kweon, YoungDo, Kelly, Mike, Park, KyungRok, Khim, JinYoung, Huemoeller, Ron

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1332-1337 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    A New RDL-First PoP Fan-Out Wafer-Level Package Process with Chip-to-Wafer Bonding Technology

    المؤلفون: Son, SeungNam, Khim, DongHyun, Yun, SeokHun, Park, JunHwan, Jeong, EunTaek, Yi, JiHun, Yoo, JinKun, Yang, KiYeul, Yi, MinJae, Lee, SangHyoun, Do, WonChul, Khim, JinYoung

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1910-1915 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    3D Packaging Challenges for High-End Applications

    المؤلفون: Agarwal, Rahul, Kannan, Sukeshwar, England, Luke, Reed, Rick, Song, Yong, Lee, WangGu, Lee, SangHyoun, Yoo, JinKun

    المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :1249-1256 May, 2017

    Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

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