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1مؤتمرSignal Integrity Analysis and Design for Cascaded Wire Bonding of Low-Power Double Data Rate (LPDDR)
المؤلفون: Ryu, Seunghun, Kim, Hyunwoong, Park, Gagyeong, Lee, Seonghi, Park, Dongryul, Lee, Sanguk, Rhee, Jaewon, Kim, Jongwook, Ahn, Seungyoung
المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :221-224 May, 2024
Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)
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2مؤتمر
المؤلفون: Kim, Haerim, Lee, Sanguk, Rhee, Jaewon, Huh, Sungryul, Jun, Youbin, Ahn, Seungyoung
المصدر: 2024 IEEE Wireless Power Technology Conference and Expo (WPTCE) Wireless Power Technology Conference and Expo (WPTCE), 2024 IEEE. :372-375 May, 2024
Relation: 2024 IEEE Wireless Power Technology Conference and Expo (WPTCE)
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3مؤتمر
المؤلفون: Lee, Hyunsoo, Woo, Seongho, Huh, Sungryul, Lee, Sanguk, Lee, Changmin, Rhee, Jaewon, Jun, Youbin, Ahn, Seungyoung
المصدر: 2024 IEEE Wireless Power Technology Conference and Expo (WPTCE) Wireless Power Technology Conference and Expo (WPTCE), 2024 IEEE. :517-521 May, 2024
Relation: 2024 IEEE Wireless Power Technology Conference and Expo (WPTCE)
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4مؤتمر
المؤلفون: Lee, Sanguk, Ahn, Jangyong, Lee, Wonho, Park, Jinseok, Ahn, Seungyoung
المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :142-144 May, 2024
Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)
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5مؤتمر
المؤلفون: Kim, Hyunwoong, Lee, Sanguk, Joung, Jong-Man, Park, Bumjin, Ahn, Seungyoung
المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :191-195 Jul, 2023
Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
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6مؤتمر
المؤلفون: Ryu, Seunghun, Kim, Hyunwoong, Lee, Seonghi, Park, Dongryul, Lee, Sanguk, Ahn, Seungyoung
المصدر: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023 IEEE Symposium on. :131-136 Jul, 2023
Relation: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
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7مؤتمر
المؤلفون: Lee, Sanguk, Jeong, Jinsu, Yoon, Jun-Sik, Baek, Seunghwan Lee, Lee, Junjong, Lim, Jaewan, Baek, Rock-Hyun
المصدر: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2023 7th IEEE. :1-3 Mar, 2023
Relation: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
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8مؤتمر
المؤلفون: Lim, Jaewan, Jeong, Jinsu, Lee, Junjong, Lee, Seunghwan, Lee, Sanguk, Baek, Rock-Hyun
المصدر: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2023 7th IEEE. :1-3 Mar, 2023
Relation: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
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9دورية أكاديمية
المؤلفون: Carman, Jennifer P.Aff1, IDs1058402403747w_cor1, Psaros, Marina, Rosenthal, Seth A., Marlon, Jennifer, Verner, Marija, Lee, Sanguk, Lu, Danning, Goldberg, Matthew H., Ballew, Matthew, Leiserowitz, Anthony
المصدر: Climatic Change: An Interdisciplinary, International Journal Devoted to the Description, Causes and Implications of Climatic Change. 177(6)
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10مؤتمر28.7 A 1.1V 6.4Gb/s/pin 24-Gb DDR5 SDRAM with a Highly-Accurate Duty Corrector and NBTI-Tolerant DLL
المؤلفون: Kwon, Daehyun, Jeong, Heon Su, Choi, Jaemin, Kim, Wijong, Kim, Jae Woong, Yoon, Junsub, Choi, Jungmin, Lee, Sanguk, Rie, Hyunsub Norbert, Lee, Jin-il, Lee, Jongbum, Jang, Taeseong, Kim, JunHyung, Kang, Sanghee, Shin, Jungbum, Loh, Yanggyoon, Lee, Chang Yong, Woo, Junmyung, Yu, Hyeseung, Bae, Changhyun, Oh, Reum, Sohn, Young-soo, Yoo, Changsik, Lee, Jooyoung
المصدر: 2023 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2023 IEEE International. :27-29 Feb, 2023
Relation: 2023 IEEE International Solid-State Circuits Conference (ISSCC)
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