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1دورية أكاديمية
المؤلفون: Li-Hsiang Liu, Lee-Cheng Liu
المصدر: AIP Advances, Vol 8, Iss 5, Pp 056605-056605-5 (2018)
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2158-3226
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2
المؤلفون: Jen Fin Lin, Hsiao Yeh Chu, Wei Jr Lin, Chang Fu Han, Ching Cherng Sun, Ion N. Mihailescu, Wen Hsuan Wu, Lee Cheng Liu, Muhammad Arif Mahmood, Jiing Yih Lai
المصدر: The International Journal of Advanced Manufacturing Technology. 111:2001-2020
مصطلحات موضوعية: Surface (mathematics), 0209 industrial biotechnology, Materials science, Mechanical Engineering, Modulus, Illuminance, 02 engineering and technology, Physics::Classical Physics, Fractal dimension, Industrial and Manufacturing Engineering, Computer Science Applications, Physics::Fluid Dynamics, Rockwell scale, 020901 industrial engineering & automation, Fractal, Control and Systems Engineering, Ultimate tensile strength, Perpendicular, Composite material, Software
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3
المؤلفون: Lee Cheng Liu, Jian Ting Lee, Yhu Jen Hwu, Chun Yi Lu, Yeau-Ren Jeng
المصدر: Tribology International. 148:106321
مصطلحات موضوعية: Materials science, Mechanical Engineering, Reduction rate, chemistry.chemical_element, 02 engineering and technology, Surfaces and Interfaces, Surface finish, 021001 nanoscience & nanotechnology, Gloss (optics), Surfaces, Coatings and Films, 020303 mechanical engineering & transports, 0203 mechanical engineering, chemistry, Mechanics of Materials, Aluminium, Lubrication, Surface roughness, Area ratio, Composite material, 0210 nano-technology
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4
المؤلفون: Tsung Ying Tsai, Jen Fin Lin, Jiing Yih Lai, Wei Jr Lin, Lee Cheng Liu, Muhammad Arif Mahmood, Yhu Jen Hwu, Wang Long Li, Jui-Wen Pan
المصدر: Journal of Materials Processing Technology. 279:116554
مصطلحات موضوعية: 0209 industrial biotechnology, Materials science, Alloy, chemistry.chemical_element, Geometry, 02 engineering and technology, STRIPS, engineering.material, Fractal dimension, Industrial and Manufacturing Engineering, law.invention, 020901 industrial engineering & automation, Fractal, 0203 mechanical engineering, Deflection (engineering), Aluminium, law, Metals and Alloys, Illuminance, Finite element method, Computer Science Applications, 020303 mechanical engineering & transports, chemistry, Modeling and Simulation, Ceramics and Composites, engineering
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5
المؤلفون: Lee-Cheng Liu, Li-Hsiang Liu
المصدر: AIP Advances, Vol 8, Iss 5, Pp 056605-056605-5 (2018)
مصطلحات موضوعية: 010302 applied physics, Electric motor, Materials science, business.industry, Stress–strain curve, General Physics and Astronomy, 02 engineering and technology, Welding, Structural engineering, engineering.material, 021001 nanoscience & nanotechnology, 01 natural sciences, lcsh:QC1-999, Clamping, Magnetic flux, law.invention, Lamination (geology), law, 0103 physical sciences, engineering, 0210 nano-technology, business, lcsh:Physics, Interlocking, Electrical steel
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6
المؤلفون: Yi-Shao Lai, Ming-Hwa R. Jen, Lee-Cheng Liu
المصدر: Microelectronics Reliability. 49:734-745
مصطلحات موضوعية: Void (astronomy), Materials science, Current crowding, Condensed Matter Physics, Microstructure, Electromigration, Atomic and Molecular Physics, and Optics, Cathode, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, law, Ball grid array, Soldering, Forensic engineering, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, Current density
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7
المؤلفون: Lee-Cheng Liu, Jenq-Dah Wu, Ming-Hwa R. Jen
المصدر: Journal of Electronic Packaging. 127:446-451
مصطلحات موضوعية: Materials science, Metallurgy, Delamination, Mechanical engineering, Computer Science Applications, Electronic, Optical and Magnetic Materials, Life testing, Reliability (semiconductor), Mechanics of Materials, Ball grid array, Soldering, Electrical and Electronic Engineering, Lead (electronics), Joint (geology), Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2ba57171e90e0b2f9112e597bad7d5db
https://doi.org/10.1115/1.2070090 -
8دورية أكاديمية
المؤلفون: Jen, Ming-Hwa R., Lee-Cheng Liu, Yi-Shao Lai
المصدر: Journal of Applied Physics; May2010, Vol. 107 Issue 9, p093526-1-093526-3, 3p
مصطلحات موضوعية: ELECTRODIFFUSION, DIFFUSION, PHYSICAL metallurgy, SOLDER joints, VACUUM
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9
المؤلفون: Lee-Cheng Liu, George J. Prokopakis
المصدر: Biotechnology and Bioengineering. 53:290-295
مصطلحات موضوعية: Work (thermodynamics), Lysis, Monte Carlo method, Bioengineering, Function (mathematics), Biology, Applied Microbiology and Biotechnology, Biochemistry, Cell disruption, Osmotic pressure, Biological system, Beta distribution, Intracellular, Biotechnology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b84e212b1746aa045972908cd3afe558
https://doi.org/10.1002/(sici)1097-0290(19970205)53:3<290::aid-bit7>3.0.co;2-d -
10
المؤلفون: Ming-Hwa R. Jen, Yi-Shao Lai, Lee-Cheng Liu
المصدر: Journal of Applied Physics. 107:093526
مصطلحات موضوعية: Growth velocity, Void (astronomy), Materials science, Soldering, Ball grid array, Metallurgy, Intermetallic, Current crowding, General Physics and Astronomy, Composite material, Electromigration, Flip chip