المؤلفون: Ambia, F., Isac, N., Harouri, A., Bouville, D., Lefeuvre, E.

المصدر: IEEE Transactions on Biomedical Engineering IEEE Trans. Biomed. Eng. Biomedical Engineering, IEEE Transactions on. 71(4):1127-1138 Apr, 2024

المؤلفون: Becan, G., Bosseboeuf, A., Phung, J., Philippe, H., Boutaud, B., Woytasik, M., Coste, P., Lefeuvre, E.

المصدر: 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2021 Symposium on. :1-5 Aug, 2021

Relation: 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

المؤلفون: Hallil, H., Dejous, C., Hage-Ali, S., Elmazria, O., Rossignol, J., Stuerga, D., Talbi, A., Mazzamurro, A., Joubert, P., Lefeuvre, E.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 21(11):12618-12632 Jun, 2021

المؤلفون: Becan, G., Phung, J., Philippe, H., Bosseboeuf, A., Coste, P., Laudrel, E., Boutaud, B., Woytasik, M., Lefeuvre, E.

المصدر: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2020 Symposium on. :1-6 Jun, 2020

Relation: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

المؤلفون: Tisnes, S. Duque, Shi, Z., Herth, E., Edmond, S., Petit, L., Martincic, E., Prelle, C., Terrien, J., Moulin, J., Lefeuvre, E., Lamarque, F.

المصدر: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2020 Symposium on. :1-5 Jun, 2020

Relation: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

المؤلفون: Becan, G., Philippe, H., Phung, J., Laudrel, E., Boutaud, B., Isac, N., Woytasik, M., Lefeuvre, E.

المصدر: 2020 14th International Symposium on Medical Information Communication Technology (ISMICT) Medical Information Communication Technology (ISMICT), 2020 14th International Symposium on. :1-6 May, 2020

Relation: 2020 14th International Symposium on Medical Information Communication Technology (ISMICT)

المؤلفون: Brenes, A., Kim, D. S., Lefeuvre, E., Kim, N., Kang, H.-W., Yoo, C.-S., Cheon, C. I., Han, S. H.

المصدر: 2019 19th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS) Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS), 2019 19th International Conference on. :1-2 Dec, 2019

Relation: 2019 19th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS)

المؤلفون: Vysotskyi, B., Parrain, F., Aubry, D., Gaucher, P., Le Roux, X., Lefeuvre, E.

المصدر: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 27(1):40-46 Feb, 2018

المؤلفون: Lu, L., Jamond, N., Eymerv, J., Lefeuvre, E., Mancini, L., Larzeau, L., Madouri, A., Saket, O., Gogneau, N., Julien, F.H., Tchernycheva, M.

المصدر: 2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO) Nanotechnology (IEEE-NANO), 2018 IEEE 18th International Conference on. :1-2 Jul, 2018

Relation: 2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO)

المؤلفون: Lefeuvre, E., Risquez, S., Woytasik, M., Deterre, M., Boutaud, B., Dal Molin, R.

المصدر: 2013 25th International Conference on Microelectronics (ICM) Microelectronics (ICM), 2013 25th International Conference on. :1-4 Dec, 2013

Relation: 2013 25th International Conference on Microelectronics (ICM)