المؤلفون: Tian, Jianing, Zhang, Minhuan, Huang, Yu, Luo, Xiaoning, Shao, Fengxia, Lei, Weiqun, Xing, Wen, Chen, Lujie, Huang, Linghui, Tan, Chunwen, Bu, Wenxuan, Yang, Xingyu, Wang, Bowen, Qin, Liping

المصدر: In Biological Control August 2024 195

المؤلفون: Lei, Weiqun, Dissado, L. A., Dodd, S. J., Chalashkanov, N. M., Fothergill, J. C., Cheng, Yonghong, Zheng, Xiaoquan

المصدر: 2017 International Symposium on Electrical Insulating Materials (ISEIM) Electrical Insulating Materials (ISEIM), 2017 International Symposium on. 1:425-428 Sep, 2017

Relation: 2017 International Symposium on Electrical Insulating Materials (ISEIM)

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المؤلفون: Jin, Yang, Zhang, Bo, Sun, Mingyu, Lei, Weiqun, Zheng, Xiaoquan, Wu, Jiang

المصدر: 2015 IEEE 11th International Conference on the Properties and Applications of Dielectric Materials (ICPADM) Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the. :468-471 Jul, 2015

Relation: 2015 IEEE 11th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

المؤلفون: Lei, Weiqun, Zhang, Bo, Zeng, Chuang, Xi, Baofeng, Zheng, Xiaoquan

المصدر: 2015 IEEE 11th International Conference on the Properties and Applications of Dielectric Materials (ICPADM) Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the. :943-946 Jul, 2015

Relation: 2015 IEEE 11th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

المؤلفون: Zhang, Zhenjun, Jiang, Wu, Lei, Weiqun

المصدر: 2015 IEEE 11th International Conference on the Properties and Applications of Dielectric Materials (ICPADM) Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the. :935-938 Jul, 2015

Relation: 2015 IEEE 11th International Conference on the Properties and Applications of Dielectric Materials (ICPADM)

المؤلفون: Lei, Weiqun, Wu, Kai, Wang, Ya, Cheng, Yonghong, Zheng, Xiaoquan, Dissado, L. A., Dodd, S. J., Chalashkanov, N. M., Fotherglll, J. C., Zhang, Chong, Li, Wenpeng

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 24(4):2268-2270 2017

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المؤلفون: Lei, Weiqun, Zhang, Bo, Zeng, Chuang, Xi, Baofeng, Zheng, Xiaoquan

المصدر: 2014 5th International Conference on Intelligent Systems, Modelling & Simulation; 2014, p943-946, 4p

المؤلفون: Zhang, Zhenjun, Jiang, Wu, Lei, Weiqun

المصدر: 2014 5th International Conference on Intelligent Systems, Modelling & Simulation; 2014, p935-938, 4p