المؤلفون: Lei-Jun Tang, Hong-Meng Ho, Yue-Jia Zhang, Yuet-Mun Lee, Che-Wei Lee

المصدر: 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :777-782 Dec, 2010

Relation: 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

المؤلفون: Whang, S.J., Lee, S.J., Fei Gao, Nan Wu, Zhu, C.X., Ji Sheng Pan, Lei Jun Tang, Kwong, D.L.

المصدر: IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004. Electron devices meeting Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International. :307-310 2004

Relation: 2004 International Electron Devices Meeting

المؤلفون: Chang Seo Park, Byung Jin Cho, Lei Jun Tang, Dim-Lee Kwong

المصدر: IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004. Electron devices meeting Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International. :299-302 2004

Relation: 2004 International Electron Devices Meeting

المؤلفون: Selvarajoo, T.A.L., Ranjan, R., Kin-Leong Pey, Lei-Jun Tang, Chih Hang Tung, Wenhe Lin

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 5(2):190-197 Jun, 2005

المؤلفون: Lei Jun Tang, Pey, K.L., Chih Hang Tung, Radhakrishnan, M.K., Wen He Lin

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 4(1):38-45 Mar, 2004

المؤلفون: Chang Seo Park, Byung Jin Cho, Wan Sik Hwang, Wei Yip Loh, Lei Jun Tang, Dim-Lee Kwong

المصدر: Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005. VLSI Technology VLSI Technology, 2005. Digest of Technical Papers. 2005 Symposium on. :48-49 2005

Relation: 2005 Symposium on VLSI Technology

المؤلفون: Lei Jun. Tang

المساهمون: Tung Chih Hang, Pey Kin Leong, School of Electrical and Electronic Engineering

مصطلحات موضوعية: Materials science, Engineering::Electrical and electronic engineering::Electronic apparatus and materials [DRNTU], business.industry, Gate dielectric, Electrical engineering, Optoelectronics, business

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::01ddbefa68e3495e7ae6ff6c9983eab0
https://doi.org/10.32657/10356/3348

المؤلفون: Yung-Tsan Yu, Lei-Jun Tang, Hong-Meng Ho, Yue-Jia Zhang, Chun-Shu Huang, Wei Koh, Kay-Soon Goh

المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Interconnection, Wire bonding, Materials science, chemistry, Dimple, Ball grid array, Metallurgy, chemistry.chemical_element, Composite material, Material properties, Copper, Corrosion, Palladium

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1ca9fd2abf0eb279d912f13b276e407d
https://doi.org/10.1109/ectc.2011.5898736

المؤلفون: Hong-Meng Ho, Che-Wei Lee, Yue-Jia Zhang, Lei-Jun Tang, Yuet-Mun Lee

المصدر: 2010 12th Electronics Packaging Technology Conference.

مصطلحات موضوعية: Materials science, Scanning electron microscope, Metallurgy, chemistry.chemical_element, engineering.material, medicine.disease_cause, Copper, Corrosion, Ion, Coating, chemistry, Chemical engineering, Mold, Halogen, engineering, medicine, Palladium

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::dfb4aa9e55c86e1695da98251dc20cf9
https://doi.org/10.1109/eptc.2010.5702754

المؤلفون: Leng-Seow Tan, Luping Shi, Xinke Liu, Kian-Ming Tan, Yee-Chia Yeo, Guo-Qiang Lo, Lei-Jun Tang, Ming Zhu, Zhi-Chien Lee, Hock Koon Lee, Hock-Chun Chin, Chih-Hang Tung

المصدر: 2008 IEEE International Electron Devices Meeting.

مصطلحات موضوعية: Materials science, Silicon oxynitride, Passivation, business.industry, Gate dielectric, Dielectric, chemistry.chemical_compound, chemistry, Gate oxide, MOSFET, Electronic engineering, Optoelectronics, business, Metal gate, High-κ dielectric

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e17f389a4c57d89a0756161c2f032a0c
https://doi.org/10.1109/iedm.2008.4796700