المؤلفون: Belardinelli, P., Lenci, S., Alijani, F.

المصدر: In Journal of Sound and Vibration 3 February 2024 570

المؤلفون: Sorokin, S.V., Lenci, S.

المصدر: In European Journal of Mechanics / A Solids January-February 2024 103

المؤلفون: Helin, Ph., Firrincieli, A., Chaudhuri, A. Ray, Pham, N., Lenci, S., Mannarino, M., Osman, H.

المصدر: 2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC) OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC), 2019 24th. :1-3 Jul, 2019

Relation: 2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC)

المؤلفون: D'heer, H., Saurav, K., Arce, C.L., Tuccio, S., Clemmen, S., Lenci, S., Stassen, A., Watte, J., Van Thourhout, D.

المصدر: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 37(10):2311-2316 May, 2019

المؤلفون: Rochus, V., Jansen, R., Figeys, B., Verhaegen, F., Rosseel, R., Merken, P., Lenci, S., Rottenberg, X.

المصدر: 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2017 19th International Conference on. :954-957 Jun, 2017

Relation: 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

المؤلفون: Rochus, V., Jansen, R., Haouari, R., Figeys, B., Mukund, V., Verhaegen, F., Goyvaerts, J., Neutens, P., O' Callaghan, J., Stassen, A., Lenci, S., Rottenberg, X.

المصدر: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on. :1-5 Apr, 2017

Relation: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Beunas, A., Robert, C., Bel, C., Racamier, J.C., Bussiere, D., Bariou, D., Khlifa, K.H., Hermann, V., Halatsis, N., Kimura, T., Kolda, P., Krzeminski, P., Lenci, S., Yates, C.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 65(6):2101-2107 Jun, 2018

المؤلفون: Belardinelli, P., Chandrashekar, A., Wiebe, R., Alijani, F., Lenci, S.

المصدر: In Mechanical Systems and Signal Processing 1 November 2022 179

المؤلفون: Hu, J., Stoffels, S., Lenci, S., De Jaeger, B., Ronchi, N., Tallarico, A.N., Wellekens, D., You, S., Bakeroot, B., Groeseneken, G., Decoutere, S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 63(9):3451-3458 Sep, 2016

المؤلفون: Tallarico, A.N., Magnone, P., Stoffels, S., Lenci, S., Hu, J., Marcon, D., Sangiorgi, E., Decoutere, S., Fiegna, C.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 63(9):3479-3486 Sep, 2016