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1دورية أكاديمية
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2مؤتمر
المؤلفون: Richter, S., Vitusevich, S., Pud, S., Li, J., Knoll, L., Trellenkamp, S., Schafer, A., Lenk, S., Zhao, Q. T., Offenhausser, A., Mantl, S., Bourdelle, K. K.
المصدر: 2013 Proceedings of the European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European. :256-259 Sep, 2013
Relation: ESSDERC 2013 - 43rd European Solid State Device Research Conference
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3دورية أكاديمية
المؤلفون: Molnár, J., Zuba, Z., Sepsi, Ö., Ujhelyi, F., Erdei, G., Lenk, S., Menyhárd, A.
المصدر: In Polymer Testing March 2021 95
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4مؤتمر
المؤلفون: Zhao, Q.T., Rije, E., Breuer, U., Lenk, S., Mantl, S.
المصدر: Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. Solid-state and integrated circuits technology Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on. 1:456-459 vol.1 2004
Relation: 2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings
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5مؤتمر
المؤلفون: Hogg, S.M., Kluth, P., Lenk, S., Zhang, M., Trellenkamp, S., Moers, J., Mantl, S.
المصدر: Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on Ion implantation technology proceedings Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on. :682-685 2002
Relation: Proceedings of the 2002 14th International Conference on Ion Implantation Technology
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6دورية أكاديمية
المؤلفون: Durgun Ozben, E., Lopes, J.M.J., Nichau, A., Luptak, R., Lenk, S., Besmehn, A., Bourdelle, K.K., Zhao, Q.-T., Schubert, J., Mantl, S.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 58(3):617-622 Mar, 2011
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7مؤتمر
المؤلفون: Grass, W., Lenk, S., Sontheim, C.
المصدر: Proceedings. 24th EUROMICRO Conference (Cat. No.98EX204) EUROMICRO Euromicro Conference, 1998. Proceedings. 24th. 1:357-364 vol.1 1998
Relation: Proceedings 24th EUROMICRO Conference
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8مؤتمر
المؤلفون: Grass, W., Grobe, C., Lenk, S., Tiedemann, W.-D., Kloos, C.D., Marin, A., Robles, T.
المصدر: Proceedings of ASP-DAC'95/CHDL'95/VLSI'95 with EDA Technofair Design automation/hardware description languages/VLSI Design Automation Conference, 1995. Proceedings of the ASP-DAC '95/CHDL '95/VLSI '95., IFIP International Conference on Hardware Description Languages. IFIP International Conference on Very Large Scal. :659-668 1995
Relation: Proceedings of ASP-DAC'95/CHDL'95/VLSI'95 with EDA Technofair
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9مؤتمر
المؤلفون: Kluth, P., Zhao, Q.-T., Winnerl, S., Lenk, S., Mantl, S.
المصدر: 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) Solid-state and integrated circuit technology Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on. 1:483-485 vol.1 2001
Relation: Proceedings of 6th International Conference on Solid-State and IC Technology
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10دورية أكاديمية
المؤلفون: Durgun Ozben, E., Lopes, J.M.J., Nichau, A., Schnee, M., Lenk, S., Besmehn, A., Bourdelle, K.K., Zhao, Q.T., Schubert, J., Mantl, S.
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 32(1):15-17 Jan, 2011