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المؤلفون: Maria Anna Rzeznik, Caroline Grand, Dennis Yee, Tony Liao, Don Cleary, Nagarajan Jayaraju, Leon R. Barstad, Zukhra Niazimbetova, Marc Lin, Joanna Dziewiszek
المصدر: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
مصطلحات موضوعية: Interconnection, Materials science, Fabrication, business.industry, 020209 energy, Metallurgy, Direct current, chemistry.chemical_element, Core (manufacturing), 02 engineering and technology, Copper, chemistry, Plating, 0202 electrical engineering, electronic engineering, information engineering, Copper plating, Optoelectronics, business, Current density
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c9489b9efd5a85e5ce6ae9574315bc75
https://doi.org/10.1109/impact.2016.7800078 -
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المؤلفون: Nagarajan Jayaraju, Zukhra Niazimbetova, Dennis Yee, Maria Anna Rzeznik, Leon R. Barstad, Marc Lin
المصدر: 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
مصطلحات موضوعية: Materials science, business.industry, Metallurgy, Process (computing), chemistry.chemical_element, Core (manufacturing), Substrate (printing), Copper, chemistry, Plating, Copper plating, Optoelectronics, business, Current density, Layer (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::482feb9925f7da4b2ca3258ef6367d60
https://doi.org/10.1109/impact.2015.7365258 -
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المؤلفون: Jayaraju Nagarajan, Mark Lefebvre, Maria Anna Rzeznik, Leon R. Barstad, Elie H. Najjar, Marc Lin
المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
مصطلحات موضوعية: Range (particle radiation), Materials science, Volume (thermodynamics), business.industry, Plating, Metallurgy, Optoelectronics, Core (manufacturing), Substrate (printing), Electroplating, business, Layer (electronics), Current density
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::164fa99a541df77b7c8f0f6a01897dce
https://doi.org/10.1109/impact.2012.6420311 -
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المؤلفون: Mark Lefebvre, Leon R. Barstad, Luis Gomez
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
مصطلحات موضوعية: Materials science, Metallurgy, chemistry.chemical_element, Epoxy, Copper, Computer Science::Other, Anode, Printed circuit board, chemistry, Chemical-mechanical planarization, visual_art, Copper plating, visual_art.visual_art_medium, Composite material, Electroplating, Layer (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0673ff72ac323ef167b29e9fc82d60c2
https://doi.org/10.1109/impact.2010.5699671 -
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المؤلفون: Mark Lefebvre, Leon R. Barstad, Luis Gomez, Bruce Chen, Elie H. Najjar, Martin W. Bayes
المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
مصطلحات موضوعية: Microvia, Substrate (building), Materials science, chemistry, Metallurgy, Electronic packaging, chemistry.chemical_element, Electroplating, Copper, Anode
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3fd69e1ea24b00b8cc0da30c7d3b66a3
https://doi.org/10.1109/impact.2009.5382313 -
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المؤلفون: Leon R. Barstad, Mark Lefebvre, Elie H. Najjar, Luis Gomez
المصدر: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.
مصطلحات موضوعية: Microvia, Interconnection, Printed circuit board, Materials science, business.industry, Plating, Copper plating, Electrical engineering, Integrated circuit packaging, Routing (electronic design automation), Process engineering, business, Electroplating
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f1d5a510566d869f3d887c4b167d11ba
https://doi.org/10.1109/impact.2008.4783818