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1مؤتمر
المؤلفون: Leong, W.Y., Leong, Y.Z., Leong, W.S.
المصدر: 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE) IOT, Communication and Engineering (ECICE), 2023 IEEE 5th Eurasia Conference on. :939-944 Oct, 2023
Relation: 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE)
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2دورية أكاديمية
المؤلفون: Shen, P., Lin, Y., Wang, H., Park, J., Leong, W.S., Lu, A., Palacios, T., Kong, J.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 65(10):4040-4052 Oct, 2018
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3مؤتمر
المؤلفون: Lin, T.Y., Davison, K.L., Leong, W.S., Chua, S., Pan, J.S., Chai, J.W., Toh, K.C., Tjiu, W.C.
المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1586-1594 2002
Relation: Proceedings of 52nd Electronic Components and Technology Conference
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4مؤتمر
المؤلفون: Lin, T.Y., Davison, K.L., Leong, W.S., Chua, S., Robin, O., Yao, Y.F., Pan, J.S., Chai, J.W., Toh, K.C., Tjiu, W.C.
المصدر: 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International. :382-388 2002
Relation: Twenty Seventh Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium
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5مؤتمر
المؤلفون: Rasiah, I.J., Leong, W.S.
المصدر: Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) Electronics packaging technology Electronics Packaging Technology Conference, 1998. Proceedings of 2nd. :291-295 1998
Relation: Proceedings of 2nd Electronics Packaging Technology Conference
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6دورية أكاديمية
المؤلفون: Lee, L.Y., Wu, S.C., Fu, S.S., Zeng, S.Y., Leong, W.S., Tan, L.P.
المصدر: In European Polymer Journal 2009 45(11):3249-3256
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7دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
8دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
9دورية أكاديمية
المؤلفون: Lin, T.Y., Davison, K.L., Leong, W.S., Chua, Simon, Yao, Y.F., Pan, J.S., Chai, J.W., Toh, K.C., Tjiu, W.C.
المصدر: In Microelectronics Reliability 2003 43(5):803-809
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10دورية أكاديمية
المؤلفون: Lin, T.Y., Leong, W.S., Chua, K.H., Oh, R., Miao, Y., Pan, J.S., Chai, J.W.
المصدر: In Microelectronics Reliability 2002 42(3):375-380
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