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1تقرير
المصدر: Journ{\'e}es d'Informatique Musicale 2024, May 2024, Marseille, France
مصطلحات موضوعية: Computer Science - Programming Languages
URL الوصول: http://arxiv.org/abs/2403.06527
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2
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3مؤتمر
المؤلفون: Bartlett, Chad, Malave, Antonio, Letz, Martin, Hoft, Michael
المصدر: 2023 53rd European Microwave Conference (EuMC) Microwave Conference (EuMC), 2023 53rd European. :347-350 Sep, 2023
Relation: 2023 53rd European Microwave Conference (EuMC)
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4تقرير
المؤلفون: Artenstein, Dalia, Letz, Janina C., Oswald, Amrei, Solotar, Andrea
مصطلحات موضوعية: Mathematics - Representation Theory, 16E40 (primary), 18G10
URL الوصول: http://arxiv.org/abs/2312.14699
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5
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6
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7مؤتمر
المؤلفون: Popoff, Maxime, Michon, Romain, Risset, Tanguy, Cochard, Pierre, Letz, Stephane, Orlarey, Yann, De Dinechin, Florent
المصدر: 2023 IEEE 34th International Conference on Application-specific Systems, Architectures and Processors (ASAP) ASAP Application-specific Systems, Architectures and Processors (ASAP), 2023 IEEE 34th International Conference on. :31-32 Jul, 2023
Relation: 2023 IEEE 34th International Conference on Application-specific Systems, Architectures and Processors (ASAP)
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8مؤتمر
المؤلفون: Letz, M., Engelmann, H., Lautenschlager, G., Brune, N., Bai, Xiaofei, Salski, B., Karpisz, T.
المصدر: 2021 51st European Microwave Conference (EuMC) European Microwave Conference (EuMC), 2021 51st. :103-106 Apr, 2022
Relation: 2021 51st European Microwave Conference (EuMC)
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9دورية أكاديمية
المؤلفون: Sivapurapu, S., Chen, R., Kanno, K., Kakutani, T., Letz, M., Liu, F., Sitaraman, S.K., Swaminathan, M.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(9):1465-1473 Sep, 2022
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10دورية أكاديمية
المؤلفون: Bartlett, C., Malave, A., Letz, M., Hoft, M.
المصدر: IEEE Journal of Microwaves IEEE J. Microw. Microwaves, IEEE Journal of. 2(2):307-315 Apr, 2022